研究目的
Investigating the direct microwelding of glass to silicon using 515 nm picosecond laser pulses to achieve a crack-free welding effect with high breaking strength and to study the new crystalline phases and element distribution in the welding area.
研究成果
Two different materials, glass and silicon, were successfully welded by ps-laser pulses of 515 nm, achieving better welding effect than laser in infrared band. In the bonded area from Monocrystalline silicon to non-crystal glass, the content of silicon decreased gradually while that of oxygen increased, which was consistent with the new phase (SiO2) generated in the laser irradiated area. The width and morphology of the welds were measured using a confocal laser scanning microscope. The obtained images verify that the production of filaments is influenced by the laser distribution and energy density, which in turn are affected by focus position, repetition frequency and scanning speed.
研究不足
The technical and application constraints of the experiments include the damage caused by laser-induced breakdown in optical components, which is the limiting factor for system performance optimization. Potential areas for optimization include the uniformity of distribution of filaments and depth of penetration of filamentous structure into the silicon.
1：Experimental Design and Method Selection:
The experiment was performed with a mode-locked Yb:YAG laser of 515 nm wavelength, 8 ps pulsewidth and average output power of 20 W, focused with a lens for microwelding Si/glass. The range of processing speed controlled by the galvanometer scanning system is 1–10,000 mm/s.
2：Sample Selection and Data Sources:
The dimensions of each substrate were 30 × 10 mm2, while the thicknesses of borosilicate glass and undoped monocrystalline silicon were
3：70 and 72 mm, respectively. List of Experimental Equipment and Materials:
Mode-locked Yb:YAG laser (TruMicro 5025 of TRUMPF Laser GmbH), lens (f = 100 mm), borosilicate glass (Schott D263), undoped monocrystalline silicon.
4：Experimental Procedures and Operational Workflow:
Prior to welding, the sample was subjected to the optical contacting process. 515-nm ps-laser pulses were focused above, at and below the interface of glass and silicon substrates in optical contact to successfully weld them at a moderately repetition rate of 200 kHz.
5：Data Analysis Methods:
Various characterization methods, including scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), high-resolution X-ray diffraction (HRXRD) and confocal laser scanning microscopy, universal tensile testing machine, inverted microscope equipped with a spectrometer and a charge-coupled device were used in this study.
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