研究目的
Investigating the fabrication of aluminum plasmonic nanogaps using a modified 'Sketch and Peel' lithography strategy to enhance the applications of aluminum plasmonics.
研究成果
The study successfully extends the applicability of the SPL process for aluminum structures via adhesion engineering, achieving aluminum plasmonic nanogaps approaching 10 nm scale. This method enables the reliable fabrication of complex plasmonic molecules and demonstrates significant potential for applications in surface-enhanced vibration spectroscopy and nonlinear optics.
研究不足
The strong adhesion between aluminum film and SiO2 substrates limits the applicability of the SPL process for high-resolution patterning of aluminum plasmonic nanogaps without surface modification.
1：Experimental Design and Method Selection:
The study employs a modified 'Sketch and Peel' lithography (SPL) process for high-resolution multiscale patterning of plasmonic nanogaps, introducing a self-assembled monolayer to engineer the surface energy of the substrate.
2：Sample Selection and Data Sources:
Aluminum nanostructures with nanogaps are fabricated on typical optical substrates such as oxidized silicon wafers or quartz substrates.
3：List of Experimental Equipment and Materials:
Hydrogen silsesquioxane (HSQ) resist, electron-beam lithography system (Raith-150Two), thermal evaporation for aluminum film deposition, X-ray photoelectron spectroscopy (PHI 5000C ESCA system), field-emission scanning electron microscope (Carl-Zeiss SIGMA HD), confocal microscope system (WITec Alpha 300R), infrared microscopy system (Nicolet in10).
4：0).
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: The process includes HSQ resist spin-coating, electron-beam lithography, development, surface modification with a self-assembled monolayer, aluminum evaporation, adhesive polymer application, and selective peeling to define aluminum structures.
5：Data Analysis Methods:
Optical measurements include transmission spectrum measurement, single-particle dark-field scattering spectra, surface-enhanced Raman spectroscopy (SERS), and micro-FTIR reflectance. Simulations of electric-field and charge distribution are performed using FDTD solution software.
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