研究目的
Demonstrating a 100 Gbps (4 × 25 Gbps) optical receiver module using Germanium photodetector fabricated through Silicon-photonics process and packaged with chip-on-board manner on a printed circuit board.
研究成果
The 100 Gbps (4 × 25 Gbps) optical receiver module using Germanium photodetector and chip-on-board packaging technique is successfully demonstrated. The module shows potential for application in higher data rate optical modules beyond 100 Gbps.
研究不足
The study is limited by the RF and optical losses in the chip-on-board packaging, which are critical for high-speed operation. The bond wire length and number, as well as PCB material and design, are key factors affecting signal integrity.
1：Experimental Design and Method Selection:
The study involves the fabrication of a Germanium photodetector through Silicon-photonics process and its packaging with a trans-impedance amplifier on a printed circuit board using chip-on-board manner. High frequency simulation tool HFSS is used for layout optimization.
2：Sample Selection and Data Sources:
The Ge PD is fabricated using IME’s silicon photonics technology platform. Optical input is provided through a lensed optical fiber coupled to the edge coupler of the Ge PD.
3：List of Experimental Equipment and Materials:
High-resistivity silicon oxide insulator (SOI) wafer, Rogers RT5880 dielectric material for PCB, Au bond wire of 1 mil diameter, and SMA connectors for signal output.
4：Experimental Procedures and Operational Workflow:
The Ge PD and TIA are die attached on PCB, interconnected by wire bonds and transmission lines. Active alignment method is used for optical fiber coupling.
5：Data Analysis Methods:
Electrical-optical S-parameter measurement for bandwidth analysis, photocurrent measurement for signal integrity analysis, and eye diagram measurement at 25 Gbps.
独家科研数据包，助您复现前沿成果，加速创新突破
获取完整内容
