研究目的
To present a concept of photonics integrated circuit packaging with radio frequency, direct current and fiber array ports with automated active alignment system for real implementation in information and communication technology applications.
研究成果
The presented concept of PIC packaging with microwave, DC, and fiber array ports with automated active alignment system offers a promising approach for transitioning PICs from research laboratories into real-world applications in information and communication technology. The initial successful experiments with software tools for automated adjustment and coupling of SMF arrays to PICs indicate potential for significant time savings and new application possibilities.
研究不足
The process is at chip level assembly and may require further optimization for mass production. The alignment precision is dependent on the resolution of the positioning systems and the quality of image processing.
1：Experimental Design and Method Selection:
The concept involves packaging photonic integrated circuits (PICs) with microwave, DC, and fiber array ports using an automated active alignment system.
2：Sample Selection and Data Sources:
Uses PIC chips, TO-05 semiconductor packages, ceramic microwave boards, and precision fiber arrays.
3：List of Experimental Equipment and Materials:
Includes FL 300 machine by ficonTEC Service GmbH for automated active alignment, HALCON development environment for machine vision, and various materials like Al sub-mount, conductive adhesive, and UV LED curing epoxy.
4：Experimental Procedures and Operational Workflow:
The process is divided into two main steps: assembling components onto an Al sub-mount and then placing the assembled sub-mount into the main package.
5：Data Analysis Methods:
Utilizes image processing for detecting edges and markers on PIC chip and fiber array for automated coupling.
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