研究目的
Characterizing absorption losses in rear side n-type polycrystalline silicon passivating contacts as a function of poly-Si thickness and understanding the trade-off between absorption losses and passivation quality.
研究成果
The study demonstrates a significant difference in Jsc losses between two sets of n-type poly-Si passivating contacts, attributed to variations in free carrier concentration and passivation quality. A trade-off exists between absorption losses and passivation quality, highlighting the importance of optimizing poly-Si thickness, doping, and annealing conditions for solar cell applications.
研究不足
The study is limited by the specific fabrication processes and materials used for the two sets of poly-Si passivating contacts. The impact of different annealing conditions and doping levels on passivation quality and absorption losses requires further investigation.
1:Experimental Design and Method Selection:
The study involved the fabrication of two sets of samples with different n-type poly-Si passivating contacts at the rear, compared to references with a phosphorus-diffused back surface field (BSF). The Jsc losses were characterized by analyzing front reflectance spectra in the infrared (IR).
2:Sample Selection and Data Sources:
Two sets of test samples with passivating contacts and corresponding references with a BSF were utilized. The first set was fabricated in-house at Imec, while the second was deposited by Tempress.
3:List of Experimental Equipment and Materials:
Equipment included a Bentham PVE300 setup for reflectance measurements, a BTimaging equipment for QSSPC measurements, and a CIPTech M300 tool for Hall measurements. Materials included n-type Cz Si wafers, poly-Si layers, and various dielectrics for passivation and antireflection coating.
4:Experimental Procedures and Operational Workflow:
The fabrication process involved saw-damage removal, texturing, cleaning, diffusion processes, deposition of passivating contacts and dielectrics, and firing. Reflectance measurements were performed to extract Jsc losses, supported by electrical and structural characterization.
5:Data Analysis Methods:
The Jsc losses were extracted from front reflectance spectra measurements, with data analyzed using PC1D simulation software. Electrical input data for simulations was obtained from measurements or wafer specifications.
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