研究目的
Investigating a method for precise trimming of high-performance Lithium Niobate photonic integrated circuits that combines low loss of Ti in-diffused technology and passive permanent trimming of direct laser writing.
研究成果
The proposed method effectively combines the advantages of Ti in-diffused technology and direct laser writing for precise trimming of Lithium Niobate photonic integrated circuits, demonstrating a significant increase in extinction ratio. This approach is promising for applications in quantum key distribution, precise sensing, and high fidelity signal processing.
研究不足
The method's applicability to mass production and its comparison with other trimming methods in terms of cost and efficiency are potential areas for further optimization.
1:Experimental Design and Method Selection:
The method involves micro-machining of a thin loading metal film on the top of a waveguide, based on the dependence of plasmon polariton excitation efficiency on the thickness of metal film.
2:Sample Selection and Data Sources:
Titanium loading film of 10 nm thickness was used, deposited in sensitive zones of the integrated optical chip.
3:List of Experimental Equipment and Materials:
A simple semiconductor pump laser (978 nm) for erbium doped fiber optic amplifier, output fiber as a probe, precise 3-axis translation stage.
4:Experimental Procedures and Operational Workflow:
The tip of the fiber was positioned close to the integrated optical chip surface, with laser power of 500 mW. The integrated optical chip was manipulated for loading film micro-machining, with optical signals monitored for on-line control.
5:Data Analysis Methods:
The adjustment of extinction ratio ER of Mach-Zehnder modulator was performed to demonstrate the method's efficiency.
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