研究目的
To investigate a printing method to prepare InGaZnO TFT devices with a bottom gate and top contact (drain and source electrodes) structure and to present a stepped annealing method to prevent the patterned channel layers from cracking and to improve the electrical properties of the channel layers when using a high annealing temperature.
研究成果
The study successfully demonstrated a printing method for InGaZnO TFT devices, utilizing a stepped annealing method to prevent cracking and improve electrical properties. The optimized printed TFT exhibited a VT of 8.7 V, a field-effect mobility of 0.071 cm2·V?1·s?1, and an Ion/Ioff of 104. Future work will focus on improving the interface to enhance performance.
研究不足
The study acknowledges that the full-printed preparation method still has a certain gap in the electrical properties compared to current TFTs, with plans to improve performance by modifying the interface, especially to address the diffusion of silver nanoparticles into the channel layer.
1:Experimental Design and Method Selection:
The study employed inkjet printing technology for the preparation of TFTs, utilizing a stepped annealing method to prevent cracking of patterned films during high-temperature annealing.
2:Sample Selection and Data Sources:
InGaZnO solutions with different molar ratios of indium, gallium, and zinc were prepared for printing.
3:List of Experimental Equipment and Materials:
Equipment included a Sonoplot nozzle, Si/SiO2 substrates, and silver nanoparticle printing inks. Materials included indium nitrate, gallium nitrate, and zinc acetate.
4:Experimental Procedures and Operational Workflow:
The process involved preparing InGaZnO inks, printing patterned channel layers, applying stepped annealing, and printing drain and source electrodes.
5:Data Analysis Methods:
The electrical performance of the TFTs was analyzed using semiconductor parametric instruments.
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Semiconductor parametric instrument
B1500A
Keysight
Used to measure output and transfer curves of TFTs.
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Optical microscope
AxioScope A1
Carl Zeiss
Used to observe the microstructures of patterned channel layers.
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Si wafer
SiO2 thickness of 285 nm
HEFEI KEJING Materials Tech Co., Ltd.
Used as the bottom gate and insulation layer for the TFT devices.
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Sonoplot nozzle
10 μm
Sonoplot
Used for printing the InGaZnO solution to form patterned layers.
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Silver nanoparticle printing inks
SIJ Technology, Inc.
Used as the raw materials for the drain and source electrodes.
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Contact angle tester
DSA25
KRüSS
Used to acquire the contact angle between the printing ink and substrates.
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Inkjet printing instruments
Microplotter II and SIJ-S050
Sonoplot and SIJ
Used to prepare patterned channel layers and drain/source electrodes.
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