研究目的
Investigating the use of a novel algorithm for solder paste inspection and shape reconstruction based on directional LED lighting to highlight geometrical features of solder paste blocks.
研究成果
The proposed algorithm can estimate solder paste shape with higher accuracy using optimized parameters, achieving an error of 4.62% for a 200μm square-shaped solder paste block.
研究不足
The accuracy of the shape estimation algorithm can be further improved by optimizing the algorithm parameters with the actual solder paste shape.
1：Experimental Design and Method Selection:
The methodology is based on a specially designed directional LED lighting to highlight the geometrical features of the solder paste block.
2：Sample Selection and Data Sources:
Solder paste blocks are used as samples.
3：List of Experimental Equipment and Materials:
Directional LED lights, digital camera.
4：Experimental Procedures and Operational Workflow:
Solder paste blocks are illuminated under different lighting configurations, and images are captured for analysis.
5：Data Analysis Methods:
An algorithm for 3D reconstruction of solder paste is developed, calculating a set of surface heights for the solder paste block.
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