研究目的
To develop a silicone pad with sufficient adhesive strength to suit the various curvatures for the lamination process of bonding an OLED backplane to a bended cover window in smartphones.
研究成果
The optimized silicone pad with a Shore hardness of 10 and a curvature of 6R showed good lamination results without air bubbles through sequential contact with the bended window. The study provides a method for efficient lamination pad design, reducing cost and time.
研究不足
The study was conducted under atmospheric conditions, which may lead to the formation of fine air bubbles. Vacuum conditions are suggested for actual lamination processes to eliminate these bubbles.
1：Experimental Design and Method Selection:
Designed a silicone pad with sufficient adhesive strength for various curvatures. Used Shore A hardness test and finite element analysis for optimization.
2：Sample Selection and Data Sources:
Prepared silicone specimens with Shore A hardness of 5, 10, and 25 according to ASTM D412 standard.
3：List of Experimental Equipment and Materials:
Used universal testing machine (UTM) for tensile modulus evaluation, RecurDyn V9R1 software for finite element analyses.
4：Experimental Procedures and Operational Workflow:
Evaluated tensile modulus, maximum load, and maximum stretched length of silicone specimens. Simulated the lamination process to optimize pad shape and properties.
5：Data Analysis Methods:
Analyzed stress distribution on contact surface and adhesive properties of OCA under different loads.
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