研究目的
Investigating the influence of two different ambient temperatures on the LED temperature within a lighting assembly.
研究成果
The study highlights the importance of considering different ambient temperatures and convection coefficients in thermal models for LED lighting assemblies to obtain more realistic simulations. It was found that accounting for the difference in fluid parameters above the primary lens and the heat sink leads to more accurate models.
研究不足
The study assumes homogeneous and isotropic materials and neglects the influence of interface thermal materials between component parts. Only conduction and convection thermal transfer were considered.
1：Experimental Design and Method Selection:
The study involves the development of thermal models, including a Spice equivalent circuit and a SolidWorks thermal simulation, based on the assumption of two ambient temperatures affecting the LED.
2：Sample Selection and Data Sources:
The LED current and voltage were measured to calculate the electric power, and temperature was monitored using a thermal imaging camera and a thermocouple for validation.
3：List of Experimental Equipment and Materials:
A chip-on-board LED, thermal imaging camera, thermocouple, and materials with specified thermal properties were used.
4：Experimental Procedures and Operational Workflow:
The LED's temperature was monitored until thermal equilibrium was reached, and simulations were performed with varying ambient temperatures and convection coefficients.
5：Data Analysis Methods:
The study compared simulation results with measurement data to validate the models.
独家科研数据包，助您复现前沿成果，加速创新突破
获取完整内容
