研究目的
Investigating the fabrication and characterization of capacitively (AC) coupled n+-in-p pixel detectors on magnetic Czochralski silicon substrates using aluminium oxide (Al2O3) grown by atomic layer deposition (ALD) as dielectric and field insulator.
研究成果
The integration of Al2O3 as field insulation dielectric and surface passivation layer into a pixel detector fabrication process was successfully demonstrated. The devices showed low leakage currents, sufficiently high breakdown voltage, and uniform charge collection efficiency, indicating promising performance for operation in pixelated detectors.
研究不足
The study focuses on unirradiated devices; the performance under high radiation levels as expected in HL-LHC conditions is not addressed. Additionally, the high initial leakage currents in pixel detectors need further optimization.
1:Experimental Design and Method Selection:
The study employs Al2O3 thin films grown by ALD as dielectric and field insulator, and TiN thin films as bias resistors.
2:Sample Selection and Data Sources:
Magnetic Czochralski silicon wafers with a thickness of 320 μm and crystal orientation ?100? were used.
3:List of Experimental Equipment and Materials:
Beneq TFS-500 batch-type ALD reactor, Keithley 2410-C SourceMeter, Keithley 6487 Picoammeter, Agilent E4980A Precision LCR meter, 2 MeV proton microprobe.
4:Experimental Procedures and Operational Workflow:
Fabrication involved wet oxidation, ion implantation, ALD of Al2O3, deposition and patterning of TiN bias resistors, and electrical characterization.
5:Data Analysis Methods:
Capacitance–voltage and current–voltage measurements were used to characterize the devices.
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