摘要： A temporary bonding film using a unique, laser releasable pressure sensitive adhesive construction has been formulated to advance wafer level fan-out process technology development. The film format and excellent thermal and dimensional stability of the temporary bonding film are particularly well suited to address the developing needs of panel level fan-out processes. The development of wafer level packaging process technology provides many benefits, including increased density and performance, greater design flexibility, simplification of the supply chain and process, and improved yield and overall cost of the semiconductor package. Specifically, in the case of fan-out, technology advances allowing wafer thinning to as little as 30 microns, backside patterning, and handling of the wafer or panel during copper RDL processing have become possible.