研究目的
To develop a fabrication process for flexible AlGaInP LED arrays that offers high yield and good electrical and optical performance, overcoming the limitations of traditional transfer processes.
研究成果
The proposed fabrication process for flexible AlGaInP LED arrays using a mature LED manufacture technique demonstrates high yield and maintains good electrical and optical performance, even in bending states. This method offers a practical solution for flexible LED applications.
研究不足
The study focuses on AlGaInP LEDs and may not directly apply to other types of LEDs without further research. The process's applicability to GaN LEDs with sapphire substrates is not explored.
1：Experimental Design and Method Selection:
The study utilizes a mature LED manufacture technique for transferring LED chips from blue PVC films to a flexible polyimide substrate.
2：Sample Selection and Data Sources:
AlGaInP LED chips are used, with a focus on their transfer to a polyimide substrate.
3：List of Experimental Equipment and Materials:
Includes polyimide substrate (DuPont, Kapton 500HN), Ti/Au layers for electrodes, conductive silver paste, and BCB for electronic isolation.
4：Experimental Procedures and Operational Workflow:
Detailed steps include deposition of Ti/Au layers, application of conductive silver paste, transfer of LED chips, BCB coating, and patterning of electrodes.
5：Data Analysis Methods:
Electrical and optical performance of the LED arrays are evaluated through current-voltage (I-V) characteristics and electroluminescence (EL) spectra measurements.
独家科研数据包，助您复现前沿成果，加速创新突破
获取完整内容
