研究目的
Investigating the effect of different laser loop parameters on the geometry of micro-groove patterns on copper substrates and their impact on the wettability of solder joints.
研究成果
The study concluded that increasing laser loop parameters enhances the depth of micro-grooves on copper substrates, leading to improved wettability of solder joints, as evidenced by reduced contact angles.
研究不足
The study is limited to the effects of laser loop parameters on copper substrates and does not explore other materials or texturing techniques. The wettability analysis is confined to Sn-0.7Cu solder alloy.
1：Experimental Design and Method Selection:
The study involved fabricating micro-groove patterns on copper substrates using laser surface texturing with varying laser loop parameters.
2：Sample Selection and Data Sources:
Flat square-shaped copper sheet specimens were used, prepared by grinding and polishing.
3：List of Experimental Equipment and Materials:
Ytterbium Fiber Laser Marking Machine, Sn-
4：7Cu solder alloy, 3D measuring laser microscope, optical microscope, and Image-J software. Experimental Procedures and Operational Workflow:
Laser surface texturing was performed with different loop parameters, followed by reflow soldering and wettability testing.
5：Data Analysis Methods:
The geometry of micro-grooves was analyzed using a 3D measuring laser microscope, and wettability was assessed through contact angle measurements.
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