研究目的
Investigating the implementation and optimization of a roll-to-roll fluidic self-assembly system for the assembly and electrical connection of semiconductor dies/chips in macroelectronics.
研究成果
The optimized roll-to-roll fluidic self-assembly system achieves high assembly rates and yields, demonstrating its potential for applications in macroelectronics such as flexible solid-state lighting modules. Future research could explore extending this scheme to smaller chip sizes and improving the reliability of electrical interconnects.
研究不足
The study is limited to semiconductor dies/chips of 300–1000 μm size. The system's scalability and reliability of electrical interconnects need further research.
1：Experimental Design and Method Selection:
The study involves the design of an automated roll-to-roll fluidic self-assembly system incorporating agitation, web motion, component dispensing, and recycling. The methodology includes fluid dynamics modeling and experimental validation of process parameters.
2：Sample Selection and Data Sources:
Semiconductor dies/chips of 300–1000 μm size were used. Data was collected through experimental testing of assembly rates and yields under various conditions.
3：List of Experimental Equipment and Materials:
Equipment includes a roll-to-roll assembly unit, component recycling and dispensing unit, and various materials such as semiconductor dies, polyimide web, and solder.
4：Experimental Procedures and Operational Workflow:
The process involves transporting components to the assembly unit, dispensing them on the substrate, assembling components on the substrate, and recycling unassembled components.
5：Data Analysis Methods:
The relationship between process parameters and forces was modeled and experimentally verified. Data analysis included testing the effect of web angle and agitation on assembly and detachment rates.
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