研究目的
To present a method for quantifying a risk for killer defects at layer level and estimating yield for substrate packages using information from design ?les.
研究成果
The paper presents a validated method for quantifying layer level risks and estimating yield for substrate packages, showing a correlation between risk layer ranks and yield with a model-to-baseline yield difference of less than 1% for tested layers.
研究不足
The method assumes that the short killer defect PDF remains the same between different designs when run through the factory line. Changes in process conditions may require recalculation of weighting factors.
1：Experimental Design and Method Selection:
The methodology involves defining a risk distance as a key parameter extracted from designs using image processing techniques.
2：Sample Selection and Data Sources:
Two different designs, each having multiple layers, are analyzed and compared with data from baseline lots.
3：List of Experimental Equipment and Materials:
MATLAB program for image processing and design Gerber files.
4：Experimental Procedures and Operational Workflow:
Image pre-processing to identify object boundary locations, geometrical information calculation, and data post-processing to calculate key risk metrics.
5：Data Analysis Methods:
Comparison of layer level risk ranks with actual yield values and validation of the yield prediction model.
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