研究目的
Investigating the interfacial friction properties during diamond polishing process and its molecular dynamic analysis to understand the wear mechanism of diamond material.
研究成果
The friction force and COF increase with the load and decrease with the rotating speed. The addition of H2O2 leads to the decrease of COF. The formation of C-O-C bridge bonds contributes to the increase of friction force. The study contributes to understanding the wear mechanism of diamond material.
研究不足
The study focuses on the interfacial friction properties during diamond polishing process under specific conditions. The generalizability of the findings to other materials or conditions may require further investigation.
1：Experimental Design and Method Selection:
The friction tests were conducted on the Universal Mechanical Tester (UMT) TriboLab from Bruker Company, Germany, using pin-on-disk system to mimic a polishing process.
2：Sample Selection and Data Sources:
A single crystal diamond sample with a size of 3 mm × 3 mm × 3 mm was used. The polishing slurry was composed of 10 wt. % diamond powders with particle size of
3：5~1 μm and deionized water. List of Experimental Equipment and Materials:
Universal Mechanical Tester (UMT) TriboLab from Bruker Company, Germany; diamond sample; diamond powders; deionized water; H2O2 solution.
4：Experimental Procedures and Operational Workflow:
Friction tests were performed under different loads and rotating speeds to investigate the dependence of COF with load and speed. The effect of H2O2 on interfacial friction was evaluated.
5：Data Analysis Methods:
The friction force and COF were automatically recorded by the tester with a sampling frequency of 100 Hz.
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