研究目的
Investigating the feasibility and issues of a laser-based approach to define contacts for wet-chemical-based metallization approaches in interdigitated back contact silicon solar cells.
研究成果
The results show laser patterning to be a promising manufacturable approach to IBC processing, but highlights the need for careful design of device processing conditions and architectures to protect the integrity of underlying layers.
研究不足
The need for careful optimization and control of laser conditions during contact processing for photovoltaic devices to minimize substrate damage and prevent parasitic Cu plating.
1：Experimental Design and Method Selection:
Laser patterning of seed layers for Cu electroplated interdigitated contacts on Ni/a-SiNx:H/Si substrates was carried out. Damage was controlled by varying the laser conditions.
2：Sample Selection and Data Sources:
Non-patterned 50 nm evaporated Ni/150 μm textured Cz-Si (1 – 5 ohm.cm) wafer (Ni/Si) working electrodes were used for easier sample handling during electroplating.
3：List of Experimental Equipment and Materials:
A Princeton Applied Research PARSTAT 2273 Advanced Electrochemical System potentiostat, Pt gauze auxiliary and saturated calomel reference (SCE) electrodes, aqueous Cu electroplating baths developed from CuSO4 / H2SO4 solutions.
4：Experimental Procedures and Operational Workflow:
CV measurements were carried out to determine the electrochemical behavior of Ar-purged Cu plating baths. Best electroplating conditions were found from unstirred, Ar-purged aqueous baths. Following plating, wafers were rinsed with DI water and dried in an Ar stream.
5：Data Analysis Methods:
Growth rates were monitored by coulometry. Contact resistance (RC) measurements were carried out using the transmission line method (TLM).
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Olympus Vanox Optical microscope
Vanox
Olympus
Optical microscopy of samples
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Thermo Scientific DXR Raman microscope
DXR
Thermo Scientific
Raman spectroscopy of samples
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Princeton Applied Research PARSTAT 2273 Advanced Electrochemical System
PARSTAT 2273
Princeton Applied Research
Potentiostat for CV measurements and electroplating
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Pt gauze auxiliary electrode
Auxiliary electrode in the 3-electrode setup
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Saturated calomel reference electrode
SCE
Reference electrode in the 3-electrode setup
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CuSO4
Alfa Aesar
Source of Cu2+ ions for electroplating bath
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H2SO4
Fisher
Acid component of electroplating bath
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Amray 1810T Digital Scanning Electron Microscope
1810T
Amray
SEM and EDS analysis of samples
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Sinton lifetime tester
Sinton
Measurement of wafer lifetimes
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