研究目的
Investigating the use of laser ultrasonics for monitoring the curing process of epoxy resin in adhesive bonding applications, particularly in aerospace structural assemblies.
研究成果
Laser ultrasonics can effectively monitor the curing process of epoxy resin, with changes in ultrasonic characteristics (velocity, amplitude, frequency) reflecting the curing state. The method is suitable for online monitoring of composite production due to its non-contact nature and broadband characteristics.
研究不足
The frequency range of the measurement is mainly concentrated in 20 MHz, limiting the analysis of higher frequency absorption attenuation. The pulse width of the pulsed laser cannot be changed, which may affect the frequency range of the measurement.
1:Experimental Design and Method Selection:
The study utilizes laser ultrasonics to monitor the curing process of epoxy resin, focusing on changes in ultrasonic wave propagation characteristics.
2:Sample Selection and Data Sources:
Samples are made of 1060 aluminum alloy and epoxy resin (3M, DP100FR), prepared by mixing resin and hardener in 1:1 vol proportions.
3:List of Experimental Equipment and Materials:
Includes a pulsed laser (Continuum) for ultrasonic wave excitation, a two-wave mixing (TWM) interferometer for detection, and a photodetector (Thorlabs) with a bandwidth of 100 MHz.
4:Experimental Procedures and Operational Workflow:
Ultrasonic waves are excited by pulsed laser and detected by TWM interferometer on the opposite side of the sample. Measurements are taken at varying intervals during the curing process.
5:Data Analysis Methods:
Ultrasonic signals are analyzed in time-frequency domain using wavelet transform to assess changes in amplitude, velocity, and frequency characteristics.
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