研究目的
Investigating the potential of silicon photonics to implement RF electrical passives integrated elements by demonstrating three variations of an RC low pass filter (LPF) monolithically integrated with a photodiode (PD).
研究成果
The study validates the feasibility of implementing passive components on PICs, demonstrating small chip-to-chip variations comparable to CMOS IC designs. The circuit model and design strategy are confirmed through experimental results, showing good agreement with expected values despite fabrication variations.
研究不足
The experimental results show discrepancies with the designed values due to fabrication process variations and fringing fields. The uneven thickness of the oxide between the capacitor metal plates and variations in the dimensions of the metal plates during the metallization process are identified as main causes.
1：Experimental Design and Method Selection:
The study involves the design and fabrication of RC low-pass filters integrated with photodiodes on a silicon photonics platform. The design strategy includes the use of lumped models for the PD and LPF, and the fabrication process details the materials and dimensions used for the components.
2：Sample Selection and Data Sources:
The samples are fabricated on a SOI wafer with specific dimensions for the silicon device layer, buried oxide layer, and substrate. The PDs and MIM capacitors are designed with precise dimensions to achieve target capacitance and resistance values.
3：List of Experimental Equipment and Materials:
The equipment includes an RF Ground-Signal-Ground (GSG) probe, an ohmmeter, and a 50 GHz lightwave component analyzer (Agilent N4373C). Materials include a SOI wafer, aluminum layers for capacitors, and a doped silicon layer for resistors.
4：Experimental Procedures and Operational Workflow:
The procedure involves measuring the implemented resistances directly on the chip, performing S-parameter measurements with a lightwave component analyzer, and using impedance fitting techniques to extract capacitance values.
5：Data Analysis Methods:
The data analysis involves using the Advanced Design System (ADS) software for optimization and fitting the S-parameter curves obtained from experimental measurements.
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