研究目的
To describe techniques for electrical cooling and thermometry of a macroscopic object, a suspended silicon chip cooled by Semiconductor – Insulator – Superconductor (SmIS) junctions.
研究成果
The silicon chip cooler provides a practical platform for various quantum devices. Future work includes optimizing thermal conductance and studying superconducting gap profiles in various superconductors.
研究不足
The electrical conductivity of the suspended chip was finite, introducing an offset to the thermometer voltage reading. The study suggests future improvements like multi-stage coolers and studying thermal conductances in superconducting leads.
1：Experimental Design and Method Selection:
The study utilizes techniques developed for electron pumps and primary thermometry. The SmIS junction technology is used for cooling and thermometry.
2：Sample Selection and Data Sources:
A heavily doped conducting silicon chip is suspended by tunnel junctions and aluminum leads.
3：List of Experimental Equipment and Materials:
Silicon wafer covered with silicon oxide, aluminum for superconducting leads, optical lithography, hydrogen fluoride vapour for oxide removal.
4：Experimental Procedures and Operational Workflow:
Fabrication of tunnel junctions, measurement and control of electrical and phonon heat fluxes, use of ac current bias for thermometer and a virtual lock-in amplifier technique.
5：Data Analysis Methods:
Fourier transform of the thermometer signal for analysis, calibration of the SINIS thermometer at multiple cryostat temperatures.
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