研究目的
Demonstrating an on-chip optical link with a simple design where micron-scale InP-based LEDs and photo diodes (PDs) are assembled onto a silicon wafer by transfer-printing and the data transmission is achieved through a spin-coated polymer waveguide butt-coupled to the printed devices.
研究成果
The study demonstrates compact, low profile optical interconnects of micron-sized LEDs coupled to micron-sized PDs on silicon, realized for the first time using transfer-printing. Data transmission is demonstrated with very low power consumption and good SNR. The results show the potential for cost-effective miniaturized on-chip opto-isolators.
研究不足
The main limiting factor for the current transfer ratio (CTR) or efficiency of the optical interconnects is the low LED output efficiencies. The interconnect loss can be reduced by improving the waveguide sidewall flatness and limiting the LED emission directions.
1：Experimental Design and Method Selection
The methodology involves the use of transfer-printing technology to integrate thin (<5 μm), micron-sized LEDs and PDs onto a silicon wafer with polymer waveguides built between them for data transmission.
2：Sample Selection and Data Sources
The samples used are InP-based LEDs and PDs prefabricated and transfer-printed to a silicon wafer. The data sources include the performance metrics of the optical interconnects such as power consumption, signal to noise ratio, and current transfer ratio.
3：List of Experimental Equipment and Materials
The equipment and materials include InP-based LEDs and PDs, polymer waveguides (SU-8 2 from MicroChem), silicon wafers, and transfer-printing technology components.
4：Experimental Procedures and Operational Workflow
The process involves the fabrication of LEDs and PDs, their transfer-printing onto a silicon wafer, the construction of polymer waveguides between them, and the measurement of data transmission performance.
5：Data Analysis Methods
The analysis includes measuring the power consumption, signal to noise ratio, and current transfer ratio of the optical interconnects to evaluate their performance.
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