研究目的
Investigating the practical concerns for adoption of microjet cooling in high power-density electronics, including thermal performance, clogging, and erosion.
研究成果
Microjet cooling offers high heat transfer performance at relatively low pumping powers, making it a viable solution for cooling high power-density electronics. Proper filter selection can effectively mitigate the risk of clogging, and the system showed no signs of erosion after a 1000-hour test. The data from this study can be used to estimate the necessary pressure drop and microjet flow rate required to achieve a desired heat transfer coefficient in similar microjet thermal management systems.
研究不足
The study focuses on a specific microjet geometry and may not be directly applicable to all microjet cooling systems. The 1000-hour test, while extensive, may not capture all long-term operational issues.
1：Experimental Design and Method Selection:
A fully conjugate computational fluid dynamics (CFD) and heat transfer model was developed in COMSOL Multiphysics
2：2a to predict the ability of the microjets to cool the integrated heater at varying flow rates. Sample Selection and Data Sources:
An embedded microjet architecture was designed and fabricated, with water as the working fluid. The electronic device is a titanium nitride (TiN) resistive heater deposited on a 200 μm thick silicon substrate.
3：List of Experimental Equipment and Materials:
A closed flow loop was constructed to examine the performance of the microjet cooling, including a recirculating water chiller, stainless steel braided tubing, Coriolis flow meter, needle valve, and a 10 μm sintered metal filter.
4：Experimental Procedures and Operational Workflow:
The microjet assembly was tested in a 1000-hour test at high flow rates to simulate operating conditions for an extended period.
5：Data Analysis Methods:
The numerical model was used to calculate the heat transfer coefficient by applying a heat flux of 3.75 kW/cm2 to the top of the silicon substrate.
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