研究目的
Investigating the origin of the Coss-losses in soft-switching GaN-on-Si power HEMTs and developing a novel transistor to mitigate these losses.
研究成果
The study identified the multi-layer III-N buffer as the main contributor to Coss-losses in GaN-on-Si HEMTs. A novel transistor with an enhanced buffer structure demonstrated a significant reduction in Coss-losses and the absence of dynamic Rds,on phenomena, enabling improved performance in soft-switching power converters.
研究不足
The measurement accuracy is influenced by the estimation of external loss contributions and the thermal coupling between the DUT and the exciting circuit. The setup's sensitivity to very low values of power loss is limited by the thermal system's time constants.
1:Experimental Design and Method Selection:
A calorimetric measurement setup was designed to characterize the soft-switching losses of GaN-on-Si HEMTs. The setup included a switching half-bridge formed by the Device-Under-Test (DUT) and an output inductor to ensure soft-switching operation.
2:Sample Selection and Data Sources:
The DUT was a commercial CoolGaN? enhancement-mode GaN power transistor IGT60R070D1 from Infineon Technologies.
3:List of Experimental Equipment and Materials:
The setup included a DC-source, input filter, switching half-bridge, output inductor, and anti-parallel diodes. Thermal measurements were performed using a fiber optic thermometer.
4:Experimental Procedures and Operational Workflow:
The half-bridge was operated with a 50% duty-cycle PWM signal at a switching frequency of 1 MHz. The temperature rise of the heat-sink was monitored to estimate the losses.
5:Data Analysis Methods:
The subtractive calorimetric measurement method was applied to isolate the switching losses from other loss contributions.
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IGT60R070D1
CoolGaN? enhancement-mode GaN power transistor
Infineon Technologies
Used as the Device-Under-Test (DUT) in the study to investigate Coss-losses.
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FOTEMPMK-19
Fiber Optic Thermometer
OPTOCON AG
Used to record the temperature of the heat-sink for calorimetric loss measurements.
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FLIR A655sc?
High definition infrared camera
FLIR
Used to measure the case temperature of the PTO DUT for validating the findings.
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C4AT
Film, Metallized Polypropylene, Power, 20 μF, 5 %, 600 V, 70 ?C, Lead Spacing = 52.5 mm
KEMET Electronics Corporation
Energy storage film-capacitors designed to maintain a constant DC-link voltage during operation of the half-bridge.
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C5750X6S2W225K250KA
Multi-layer ceramic capacitors (MLCCs)
TDK Corporation
Installed to improve the switching performance of the half-bridge by minimizing the commutation loop inductance.
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C3D1P7060Q
SiC Schottky diodes
Cree Inc.
Connected in parallel to the DUT to reduce the conduction losses occurring during the dead-times of the half-bridge.
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C1206C101KCGACTU
MLCCs
KEMET Electronics Corporation
External capacitors connected in parallel to the DUT for measurement purposes.
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H48-6G
Thermal Conductive Pad
t-Global TECHNOLOGY
Used to provide electric insulation and thermal coupling between the DUT and the heat-sink.
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