摘要： In the process of the optical interconnection module soldering assembly, the mismatch of the thermal expansion coefficient between the substrate and PCB would result in the production of alignment offset between light source devices and light-coupled devices, which would lead to light power loss. It is of great significance to study on the optical interconnect module alignment offset in the assembly process to improve optical interconnect module coupling efficiency. In the present study, an optical interconnection module key position post soldering shift offset measurement system was established, and an optical interconnection module experimental sample was prepared. The key position post soldering shift in the X and Y directions were measured. The 3D finite element analysis model of a typical optical interconnect module was established, and post soldering shift offsets were calculated after the finite elements analysis of the reflow soldering temperature load. The coupling efficiency simulation model of the optical interconnection module was established using the ZEMAX software, and the coupling efficiency was calculated according to the alignment offset measured in the experiment. The results revealed the following: The post soldering alignment offsets in the X and Y direction were 0.316 μm and 0.422 μm, respectively, and the synthetic alignment offset was 0.527 μm. The post soldering alignment offset calculated using the finite element simulation model was 0.436 μm, and its error was 17.2%, when compared with the measured value. The coupling efficiency of the optical interconnection module was 85.804% when the post soldering alignment offset was 0.527 μm.