研究目的
To measure the 3D anisotropic thermal conductivity tensor of a (010)-oriented β-Ga2O3 single crystal and understand its temperature dependence and the role of impurity scattering.
研究成果
The 3D anisotropic thermal conductivity tensor of a (010) β-Ga2O3 substrate was measured using an elliptical-beam TDTR method. The [010] direction has the highest thermal conductivity and the [100] direction has the lowest. The temperature-dependent thermal conductivity exhibits a 1/T1.3 dependence over the temperature range 80–400 K. The current measurement of temperature-dependent thermal conductivity agrees very well with theoretical model calculations and a first-principles calculation from the literature.
研究不足
The discrepancy in thermal conductivity measurements at low temperatures <200 K between the current study and previous studies could be due to different impurity concentrations or different heat capacity values used in the studies.
1：Experimental Design and Method Selection:
The 3D anisotropic thermal conductivity tensor of a (010)-oriented β-Ga2O3 single crystal was measured using a recently developed elliptical-beam time-domain thermoreflectance (TDTR) method.
2：Sample Selection and Data Sources:
A (010)-oriented β-Ga2O3 single crystal purchased from Tamura Corporation (Japan) was used.
3：List of Experimental Equipment and Materials:
A thin Al film with a nominal thickness of 100 nm was deposited on the (010) surface of the Ga2O3 substrate acting as a metal transducer for TDTR measurements.
4：Experimental Procedures and Operational Workflow:
A pair of cylindrical lenses were inserted in the pump path to generate a highly elliptical pump spot on the sample surface, whereas a circular beam was still used as the probe.
5：Data Analysis Methods:
The thermal properties of the sample, including the in-plane thermal conductivity in the h angle K||(h), the through-plane thermal conductivity Kz, and the Al/Ga2O3 interface thermal conductance G, were determined by fitting the measured ratio signals ?Vin/Vout as a function of delay time using a thermal transport model.
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