研究目的
To develop compact, efficient, and low-cost millimeter wave filters using substrate integrated waveguide (SIW) technology with cyclo-olefin polymers (COP) for high performance applications.
研究成果
The study demonstrated that high quality factor filters can be fabricated on COP substrates through a cost-efficient and robust process combining molding, machining, and LDS for metallization. The approach is applicable for real 3D devices in the centimetric frequency range, offering advantages in terms of electrical constraints and interconnection compatibility.
研究不足
The LDS technique does not allow vertical walls to be activated, leading to modifications in the shape of walls and vias. The molding process has limitations in filling the entire mold, especially in low thickness areas. The surface roughness of the metallization and discrepancies in dimensions affect the electrical response.
1：Experimental Design and Method Selection:
The study involved designing narrow-band SIW millimeter wave band-pass filters using COP, molded, drilled, and metalized with a laser direct structuring (LDS) process.
2：Sample Selection and Data Sources:
COP RS420-LDS from Zeon? was used for its low dielectric losses in the millimeter waveband.
3：List of Experimental Equipment and Materials:
The filters were fabricated using molding, machining, and LDS for metallization. Measurements were made using a VNA E8364a from Agilent? and a universal test fixture 3680 V from Anritsu?.
4：Experimental Procedures and Operational Workflow:
The process included molding the COP, activating the substrate locally with a laser beam for LDS, and metallizing the activated surfaces.
5：Data Analysis Methods:
The electrical responses of the filters were compared with simulations to validate the approach.
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