研究目的
To control the ion bombardment process of growing thin films and to improve their structure and properties using BP-HiPIMS.
研究成果
BP-HiPIMS enables an energy-enhanced deposition process, improving the structure and properties of copper thin films. The technique allows for control over ion energies and fluxes, leading to films with smooth surfaces, dense microstructure, and good adhesion. However, there is no net increase in deposition rate compared to the monopolar regime due to re-sputtering.
研究不足
The study is limited to copper thin films and silicon substrates. The effects of BP-HiPIMS on other materials and substrates were not investigated. The study also notes potential measurement errors in film density estimation.
1:Experimental Design and Method Selection:
BP-HiPIMS was used to deposit copper thin films on silicon substrates. Energy-resolving mass spectroscopy and fast ICCD imaging were employed to investigate ion energies and fluxes, and plasma dynamics, respectively.
2:Sample Selection and Data Sources:
High-purity copper target and silicon substrates were used. Data were collected using mass spectroscopy, AFM, XRD, RBS, TDS, SEM, nanoindentation, and scratch tests.
3:List of Experimental Equipment and Materials:
A planar circular balanced magnetron, high-purity Cu target, argon gas, energy resolving mass spectrometer (EQP 1000, Hiden Analytical), fast gated intensified charge-coupled device (ICCD) camera (Andor, iSTAR), atomic force microscope (NT-MDT SolvePro), FEI Inspect S SEM, Bruker A8 Advanced diffractometer, Nanoindentation Tester (NHT2), and Micro-Scratch Tester (MST) (Anton Paar, CSM Instruments).
4:Experimental Procedures and Operational Workflow:
The deposition chamber was evacuated to a base pressure lower than 10-4 Pa. Sputtering argon gas was flowed into the chamber at a constant rate. Films were deposited using mono- and bipolar HiPIMS modes with varying reverse target voltages.
5:Data Analysis Methods:
Data were analyzed using SIMNRA software for RBS spectra, and mechanical properties were calculated using the Oliver-Pharr approach.
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energy resolving mass spectrometer
EQP 1000
Hiden Analytical
Investigate the ion energy distribution functions and ion fluxes onto the substrate.
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fast gated intensified charge-coupled device camera
iSTAR
Andor
Investigate the plasma dynamics.
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scanning electron microscope
Inspect S
FEI
Analyse the cross-sectional microstructure of the Cu films and determine their precise thickness.
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X-ray diffractometer
A8 Advanced
Bruker
Characterize the crystallinity of the deposited films and estimate several structural parameters.
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atomic force microscope
NT-MDT SolvePro
NT-MDT
Examine films’ surface topography and roughness.
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Nanoindentation Tester
NHT2
Anton Paar, CSM Instruments
Characterize the mechanical properties of the deposited Cu thin films.
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Micro-Scratch Tester
MST
Anton Paar, CSM Instruments
Characterize the mechanical properties of the deposited Cu thin films.
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