1：Experimental Design and Method Selection:

The study involved designing a new adhesion shear test jig to measure adhesion strength at high temperature (200°C), varying plasma treatment numbers and moisture absorption times, and using AFM and SEM for surface and fracture analysis.

2：Sample Selection and Data Sources:

Specimens were semiconductor packages from Samsung Electronics, consisting of EMC, Si chip, DAF, and PCB, with plasma treatments applied to Si chip surfaces.

3：List of Experimental Equipment and Materials:

Equipment includes the devised adhesion test jig, micro tensile-testing machine (LLOYD Instrument), thermal chamber (SH-ND054, SAMHEUNG ENERGY), water bath (LWB-122A, DANHAN LABTECH Co.), AFM (XE100, PSIA), SEM (S4800, Hitachi), and ABAQUS software for FEM analysis. Materials include Ar gas for plasma treatment and various semiconductor package components.

4：Experimental Procedures and Operational Workflow:

Specimens were prepared with varying plasma treatments, mounted in the test jig, heated to 200°C, and subjected to shear tests. Moisture absorption tests involved immersion in water at 85°C for specified times, followed by adhesion strength measurements. AFM and SEM were used for surface roughness and fracture morphology analysis.

5：Data Analysis Methods:

Adhesion strength was calculated from load-displacement curves, with averages and standard deviations computed. Moisture uptake was calculated using weight measurements. FEM analysis was conducted to study stress distribution.