1：Experimental Design and Method Selection:

The study involved designing an interdigital capacitive sensor for impedance spectroscopy to monitor curing and damage in composite joints. The sensor was inkjet-printed directly onto the bondline, and impedance measurements were used to assess dielectric properties.

2：Sample Selection and Data Sources:

Carbon Fiber Reinforced Polymer (CFRP) single lap joints were manufactured according to ASTM D5868-01. Specimens included those with and without printed sensors, and some had artificial defects (e.g., Kapton film) for comparison.

3：Specimens included those with and without printed sensors, and some had artificial defects (e.g., Kapton film) for comparison. List of Experimental Equipment and Materials:

3. List of Experimental Equipment and Materials: Equipment included a Dimatix DMP 2850 inkjet printer, E4990A impedance analyzer, Instron universal testing machine, FLIR A615/25 IR camera, JEOL JSM 6510LV SEM, ultrasonic mixer, and laboratory oven. Materials included silver nanoparticle ink, MWCNTs (Graphistrength by Arkema), epoxy adhesive (Araldite LY 5052/Aradur 5052), and CFRP prepreg (Hexply 914-TS-5-134).

4：4). Experimental Procedures and Operational Workflow:

4. Experimental Procedures and Operational Workflow: Sensors were printed and sintered onto bondlines. Curing was monitored via impedance spectroscopy. Mechanical step-loading tests were conducted, with impedance and thermography measurements taken at each load step. Fracture surfaces were analyzed using SEM.

5：Data Analysis Methods:

Impedance data (e.g., Z''max, |Z|) were analyzed to correlate with curing stages and damage. Statistical analysis of mechanical strength was performed, and thermography images were processed using FFT for phase analysis.