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Experimental Evaluation and Analysis of Switching Transient's Effect on Dynamic On-Resistance in GaN HEMTs

DOI:10.1109/TPEL.2019.2890874 期刊:IEEE Transactions on Power Electronics 出版年份:2019 更新时间:2025-09-23 15:22:29
摘要: The dynamic on-resistance is problematic as it can impair the converter's efficiency due to the increased conduction loss. In this paper, the hard-switching transient's effect on the dynamic on-resistance is, for the first time, evaluated experimentally on a commercial high-voltage GaN HEMT. A new R_dyn-ds,on measurement circuit with fast sensing speed is designed, and an accurate measurement of R_dyn-ds,on can be realized experimentally within 49.6 ns after the device's current reaches to the load current. A double-pulse-test setup is designed to comprehensively evaluate the switching transient's effect on R_dyn-ds,on under different operating conditions. From the experimental results, it is found that the turn-on and turn-off gate resistance have a significant impact on the dynamic on-resistance whereas the cross-talk effect on R_dyn-ds,on is negligible. Specifically, at 400 V/25 A, more than 27% (28.2%) increase in R_dyn-ds,on is observed when the external turn-on (turn-off) gate resistance increases from 0 Ω to 20 Ω. Detailed discussion and quantitative analysis are provided to explain the experimental results. In terms of the turn-on process, it is concluded that the R_dyn-ds,on variation is mainly caused by the different numbers of generated hot electrons. For the turn-off transient, it is confirmed the variation of drain current at different dv/dt slew rate leads to the R_dyn-ds,on difference.
作者: Fei Yang,Chi Xu,Bilal Akin
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To evaluate the hard-switching transient's effect on the dynamic on-resistance in GaN HEMTs experimentally and analyze the impact of gate resistance and cross-talk on dynamic on-resistance under various operating conditions.

The turn-on and turn-off gate resistances significantly affect dynamic on-resistance due to variations in hot electron generation, while cross-talk has negligible impact. A fast measurement circuit enables accurate assessment within 49.6 ns. Findings are crucial for optimizing GaN-based converter efficiency by considering gate resistance effects in design.

The study focuses on hard-switching transients and a specific commercial GaN HEMT; results may not generalize to other devices or soft-switching conditions. The measurement circuit's accuracy depends on component selection and parasitic effects. Future work is needed to investigate the physical reasons behind hot electron generation.

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