研究目的
To estimate the energy and time savings in optical glass manufacturing when using ultrasonic vibration-assisted grinding (UVAG) compared to traditional grinding (TG), by investigating specific grinding energy and subsurface damage depth.
研究成果
UVAG reduces grinding forces and specific grinding energy by up to 85%, and decreases subsurface damage depth, leading to significant time savings in polishing (up to 39% reduction). This demonstrates UVAG's potential for energy-efficient and time-saving green manufacturing of optical components, with economic benefits.
研究不足
The study is limited to K9 optical glass and specific grinding parameters; results may not generalize to other materials or conditions. The ultrasonic vibration device's power consumption is measured but not optimized. The magnetorheological polishing spot method assumes uniform material removal rates, which may not hold in all polishing technologies.
1：Experimental Design and Method Selection:
The study compares traditional grinding (TG) and axial ultrasonic vibration-assisted grinding (UVAG) processes on optical glasses. Grinding forces are measured, specific grinding energies are calculated, and subsurface damage depths are analyzed using the magnetorheological polishing spot method to estimate energy and time savings.
2：Sample Selection and Data Sources:
K9 glass workpieces of size 15 × 15 × 2 mm3 are used. Data are collected from repeated machining processes under various parameters.
3：List of Experimental Equipment and Materials:
Equipment includes a precision surface grinder (Schleifring KP-48T), axial ultrasonic vibration device, piezoelectric dynamometer (Kistler 2825A-02), power meter (Tecman TM16), magnetorheological polishing machine, profilometer (Taylor Hobson Form Talysurf 200), microscope system (Keyence VK-X200), and ultrasonic cleaner. Materials include resin-bonded-diamond grinding wheel (W40), water-based grinding coolant, HF solution, acetone, alcohol, and distilled water.
4：Experimental Procedures and Operational Workflow:
The grinding wheel is redressed before each experiment. Workpieces are adhered to an ultrasonic vibrator. Grinding forces are measured using a dynamometer. Specific grinding energy is calculated from force measurements and power consumption. Subsurface damage depth is measured by polishing spots, etching with HF, cleaning, and profiling. Measurements are averaged over three repetitions.
5：Data Analysis Methods:
Statistical analysis of grinding forces and specific grinding energies. Subsurface damage depth is determined from profilometer data. Energy and time savings are calculated using derived formulas.
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profilometer
Form Talysurf 200
Taylor Hobson
Measures profiles of polished spots for subsurface damage analysis.
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precision surface grinder
KP-48T
Schleifring
Used for grinding experiments on optical glasses.
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piezoelectric dynamometer
2825A-02
Kistler
Measures normal and tangential grinding forces.
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power meter
TM16
Tecman
Measures power consumption of the ultrasonic vibration device.
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microscope system
VK-X200
Keyence
Observes and measures subsurface damage depths.
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grinding wheel
W40
Resin-bonded-diamond
Used for grinding optical glasses.
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magnetorheological polishing machine
Used for polishing spots to measure subsurface damage.
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ultrasonic cleaner
Cleans samples after etching.
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