1：Experimental Design and Method Selection:

The study uses a simulation approach based on equivalent electrical circuit models of photonic components developed in ADS (Advanced Design System) with a co-simulation technique combining analog and digital signals. It investigates RoF links including directly modulated VCSEL with integrated photoreceiver, electroabsorption-modulated laser with PIN photodiode, and Mach-Zehnder Modulator with PIN photodiode.

2：Sample Selection and Data Sources:

The RoF links are based on commercial low-cost modules and external modulation schemes. Specific components include TOSA/ROSA modules from Finisar, MZM from iXBlue (Photline), EAM from III-V Lab, and PIN photodiode from New Focus.

3：List of Experimental Equipment and Materials:

Equipment includes Arbitrary Waveform Generator (AWG) Agilent M8190A, high-speed oscilloscope Agilent Infiniium DSO81004B, VCSEL, PIN photodiode, MZM, EAM, DFB laser, transimpedance amplifier (TIA), low noise amplifier (LNA), high-power amplifier (HPA), mixers (e.g., CHM1298-99F from United Monolithic Semiconductors), voltage-controlled oscillators (VCOs), attenuators, and optical fibers.

4：Experimental Procedures and Operational Workflow:

The setup involves generating OFDM signals at 3 GHz using AWG, modulating them through RoF links, photodetecting, and analyzing EVM. For wireless channel simulation, the Saleh-Valenzuela model is used with frequency up- and down-conversion circuits to mm-wave band.

5：Data Analysis Methods:

EVM is computed as a function of OFDM signal power and component biasing, with comparisons to IEEE 802.15.3c standard limits. Simulations use ADS for co-simulation, and noise analysis includes RIN, shot noise, and thermal noise contributions.