研究目的
Investigating the performance of a 1550 nm photon pair source based on spontaneous four-wave mixing (SFWM) in a micro-ring resonator before and after transfer of the photonic SOI functions to an electronic BiCMOS wafer.
研究成果
The SFWM-enabled photon pair engine on SOI technology demonstrates high performance with up to 40 coincidences/s and 95% visibility for CWDM and DWDM emission. Transfer to a BiCMOS wafer via 3D integration shows comparable performance with only slight degradation due to coupling losses, proving feasibility for co-integrating quantum optics and electronics on the same chip. Future work could optimize coupling efficiency and explore gated SPAD configurations for improved rates.
研究不足
The study is limited by reduced fiber-to-waveguide coupling efficiency after transfer to the BiCMOS wafer, leading to degradation in coincidence rate and visibility. The use of external pumping and free-running SPADs with low efficiency (10%) may constrain performance, and the integration process could introduce losses not fully characterized.
1：Experimental Design and Method Selection:
The study uses a silicon micro-ring resonator (MRR) for photon pair generation via spontaneous four-wave mixing (SFWM), with resonant enhancement and spectral slicing. Two MRRs with CWDM and DWDM free spectral ranges (FSR) are fabricated on SOI technology. An external laser pumps the MRRs, and side-modes are suppressed using matched add-drop filters. Quantum regime characterization is done with free-running InGaAs single-photon avalanche photodiodes (SPADs), and emission spectra are analyzed with a single-photon spectrum analyzer (hν-OSA) consisting of a tunable grating filter (TGF) and SPAD. Detection counts and coincidences are registered with a time-tagging module.
2：Sample Selection and Data Sources:
Samples include photonic dies on SOI and after transfer to a BiCMOS wafer. Data are collected from transmission spectra, SFWM emission spectra, and coincidence measurements.
3：List of Experimental Equipment and Materials:
Equipment includes external laser, add-drop filters, MRRs, SPADs, TGF, time-tagging module, and DWDM demultiplexer. Materials include silicon-on-insulator wafers and BiCMOS wafers.
4：Experimental Procedures and Operational Workflow:
The MRR is pumped with an external laser; SFWM emission is filtered and analyzed. Coincidences are measured for signal and idler photons before and after wafer transfer.
5：Data Analysis Methods:
Data analysis involves comparing transmission and emission spectra, and calculating coincidence rates and visibilities using statistical methods from time-tagged data.
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