研究目的
To demonstrate 400G multi-mode and single-mode optical engines using a Silicon interposer platform for data center applications, addressing the need for compact, high-density integration with superior signal integrity to resolve traffic congestion.
研究成果
The hybrid Silicon interposer platform successfully enables compact and high-performance 400G optical engines for both multi-mode and single-mode applications, with excellent signal integrity, optical eye quality, and BER performance. It leverages mature III-V lasers and Silicon precision, offering advantages for rapid adoption in 400G optics, including potential use in transceivers, AOCs, and variants like DR4 and FR4.
研究不足
The technology is focused on data center applications with short reach (up to few hundred meters for MM and ~2km for SM), and may not be suitable for longer distances. The use of active alignment for EML-SMF engine adds complexity compared to passive methods. Cost and production scalability of SiPh modulators for 100Gb/s PAM-4 are still evolving.
1：Experimental Design and Method Selection:
The experiment involves designing and fabricating optical engines using a Silicon interposer for hybrid integration of laser dice, optics, and fiber arrays. Silicon bulk micro-machining is used for precision. Methods include multi-chip module (MCM) assembly, passive and active alignment for optics, and chip-on-board (COB) integration with module PCB.
2：Sample Selection and Data Sources:
Samples include VCSEL and EML laser dice, PiN PDs, micro-optics, and fiber arrays. Data is sourced from experimental characterization using a 400G QSFP-DD transceiver form-factor as a test vehicle.
3：List of Experimental Equipment and Materials:
Equipment includes a bit error rate tester (BERT) with 50Gb/s PAM4 lane speed, automatic bonder for active alignment, and fixtures for passive alignment. Materials include Silicon interposers, VCSELs, EMLs, micro-optics, fiber arrays, and epoxy for bonding.
4：Experimental Procedures and Operational Workflow:
For VCSEL-MMF engine: die bond and wire bond laser chips onto Silicon interposer, stack top Silicon with fiber array using passive alignment. For EML-SMF engine: MCM assemble EML and MPD, actively align Si lenses with automatic bonder, bond fiber block passively. Both engines are COB integrated with module PCB and laser driver. Perform optical eye diagram and BER testing using BERT and loop-back configurations.
5：Data Analysis Methods:
Analyze optical eye diagrams for TDECQ values and BER performance using standard IEEE metrics. Statistical analysis is implied through typical values over temperature ranges.
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