研究目的
To develop a high-performance poly-Si TFT-based ISFET pH sensor with enhanced sensitivity using a triple gate structure, surpassing the performance of dual-gate sensors.
研究成果
The triple gate ISFET demonstrated significantly higher pH sensitivity (1283.56 mV/pH) compared to SG and DG modes, with improved non-ideal behavior. It shows promise as a biosensor platform with excellent sensitivity and stability.
研究不足
The hysteresis width and drift rate were higher in TG mode compared to SG and DG modes, though stability improved when considering sensitivity amplification. Further optimization may be needed for practical biosensor applications.
1:Experimental Design and Method Selection:
The study designed a triple gate ISFET to enhance pH sensitivity through capacitive coupling effects. Methods include fabrication of poly-Si TFT-based devices and electrical characterization.
2:Sample Selection and Data Sources:
Fabricated triple gate ISFET transducers and extended gate detectors using poly-Si thin films and glass substrates. pH buffer solutions were used for sensitivity testing.
3:List of Experimental Equipment and Materials:
Equipment includes LPCVD system, KrF excimer laser, RIE system, RF magnetron sputtering, e-beam evaporator, Agilent 4156B Precision Semiconductor Parameter Analyzer. Materials include phosphorus-doped poly-Si, SiO2, amorphous Si, aluminum, ITO, SnO2, PDMS.
4:Experimental Procedures and Operational Workflow:
Fabrication involved deposition, annealing, photolithography, etching processes. Electrical measurements were conducted in a dark box using the parameter analyzer for SG, DG, and TG modes.
5:Data Analysis Methods:
Sensitivity was calculated as ΔVR per pH, with VR defined at 1 nA drain current. Hysteresis and drift rates were measured and analyzed statistically.
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Precision Semiconductor Parameter Analyzer
4156B
Agilent
Used for measuring electrical characteristics of the ISFET devices, including drain current and gate voltage scans.
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Low-Pressure Chemical Vapor Deposition System
Used for depositing poly-Si and other thin films during device fabrication.
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KrF Excimer Laser Annealing System
Used for crystallizing amorphous Si films to form poly-Si channels.
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Reactive Ion-Etching System
Used for etching processes to define device structures.
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RF Magnetron Sputtering System
Used for depositing SiO2 top gate oxide films.
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E-beam Evaporator
Used for depositing aluminum films for electrodes.
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