研究目的
To develop a real-time sensor for monitoring grain losses during harvesting by utilizing two crossed polyvinylidene fluoride (PVDF) films to improve detection accuracy and reduce error-recognition ratio.
研究成果
The developed grain impact sensor with two crossed PVDF films effectively obtains spatial distribution of grain loss, reducing error-recognition through multi-sensor fusion. Simulations indicate that narrower and shorter sensor units with proper thickness enhance sensitivity and response speed, while stress and deformation transfer efficiencies are optimized within specific dimensional ranges. Future work should include physical validation and further refinement for agricultural applications.
研究不足
The study relies on simulations without physical prototype testing, which may not fully capture real-world conditions. The sensor's performance is dependent on material properties and dimensions, and it may not distinguish grains impacting at the same position and time. Optimization is based on linear assumptions, and practical implementation could face challenges in wiring and integration.
1：Experimental Design and Method Selection:
The study involved designing a grain impact sensor with two crossed PVDF film layers, using finite element method (FEM) simulations in ANSYS Workbench to optimize sensor unit dimensions. Modal and transient structure simulations were conducted to analyze natural frequencies, deformations, stress, and deformation transfer efficiencies.
2：Sample Selection and Data Sources:
Sensor units were modeled with PVDF and PET films; parameters such as Young's modulus, Poisson's ratio, and density were set based on material properties. Force inputs for simulations were derived from prior research (e.g., Z. Zhao, 2013).
3：3).
List of Experimental Equipment and Materials:
3. List of Experimental Equipment and Materials: PVDF films (thickness 0.028-0.11 mm), PET films (0.08 mm thick), support plate, damping layer, signal processing components (charge amplifier, band-pass filter, envelope detector, voltage comparator), and ANSYS Workbench software for simulations.
4：028-11 mm), PET films (08 mm thick), support plate, damping layer, signal processing components (charge amplifier, band-pass filter, envelope detector, voltage comparator), and ANSYS Workbench software for simulations.
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: Modal simulations analyzed natural frequencies and deformations; transient structure simulations assessed stress and deformation transfer between layers. Independent variables included sensor unit width, length, thickness, and applied force; dependent variables were deformation, stress, and transfer efficiencies.
5：Data Analysis Methods:
Linear sensitivity analysis was performed on simulation results; stress transfer efficiency (E_Force) and deformation transfer efficiency (E_Deformation) were calculated using maximum stress and deformation values from upper and lower layers.
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