研究目的
To present a comprehensive design methodology for microstrip broadband attenuators that avoid the use of plated via holes to ground, facilitating manufacture and achieving proper performance at millimeter wave frequencies.
研究成果
The proposed design methodology for microstrip broadband attenuators without via-hole-ground is validated through experimental results, showing good agreement with simulations. The attenuators exhibit high return loss and flat insertion loss over a wide frequency band, making them suitable for microwave and millimeter wave applications, with potential for integration in MMICs and variable attenuators using materials like graphene.
研究不足
The attenuators require careful design to manage impedance matching, especially for high attenuation values, and the manufacturing process involves tolerances in resistive layers (±20%). The bandwidth and performance are dependent on the number of resistor sections and electrical lengths.
1：Experimental Design and Method Selection:
The methodology involves closed-form design equations for distributed attenuators based on cascade connections of thin-film resistors and microstrip line sections, analyzed using Scattering parameter equations and ABCD matrix computations.
2：Sample Selection and Data Sources:
Attenuators are designed and manufactured on alumina substrate with specific material properties.
3：List of Experimental Equipment and Materials:
Alumina substrate (er =
4：9, h = 10 mils), NiCr resistive layer (20 Ω/sq), gold conductor layer (3 μm thickness), coplanar to microstrip transitions, and bonding wires for testing. Experimental Procedures and Operational Workflow:
Design attenuators using analytical equations, simulate with Advanced Design System (ADS), manufacture using laser and lithographic processes, and test using a coplanar probe station with calibration.
5：Data Analysis Methods:
S-parameters are computed and analyzed to evaluate insertion loss and return loss, with comparisons between simulation and experimental results.
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