研究目的
To present a novel piezoelectric micromachined ultrasonic transducer (PMUT) based on mechanical coupling between an annular diaphragm and a circular diaphragm to enhance transmission sensitivity and reduce cross-talk effects in array configurations.
研究成果
The proposed ACC-PMUT structure significantly enhances transmission sensitivity by 173% at 6.14 MHz in water compared to traditional PMUTs, due to mechanical coupling and base excitation. It also exhibits reduced cross-talk effects in array configurations, maintaining consistent working frequencies. This simplifies PMUT array design and improves performance for ultrasonic applications.
研究不足
The study is based on simulations and theoretical models; experimental validation with physical prototypes is not provided. The analysis assumes certain conditions, such as negligible damping for the annular diaphragm, which may not hold in all real-world scenarios. Fabrication complexities and potential issues in practical implementation are not addressed.
1：Experimental Design and Method Selection:
The study involved designing an annular-circular coupled PMUT (ACC-PMUT) structure, establishing a 2 DOF lumped model for dynamic analysis, and using a transversal optimization method for structural dimensions. Simulation was conducted based on Runge-Kutta-Felhberg numerical method.
2：Sample Selection and Data Sources:
The analysis used theoretical models and simulations; no physical samples or datasets were specified.
3：List of Experimental Equipment and Materials:
Materials included Silicon-on-Insulator (SOI) wafers, SiO2 insulating layer (100 nm thickness), Mo electrodes (130 nm thickness), piezoelectric AlN layer (750 nm thickness), PSG sacrificial layer (600 nm thickness), Poly-Si diaphragm (1.8 μm thickness), and TEOS silicon dioxide (2 μm thickness). Fabrication processes involved etching, bonding, mechanical polishing, RIE, LPCVD, PECVD, photolithography, and gaseous HF release.
4：8 μm thickness), and TEOS silicon dioxide (2 μm thickness). Fabrication processes involved etching, bonding, mechanical polishing, RIE, LPCVD, PECVD, photolithography, and gaseous HF release.
Experimental Procedures and Operational Workflow:
4. Experimental Procedures and Operational Workflow: The fabrication process included steps such as etching annular conduits, bonding wafers, depositing layers, and releasing sacrificial material. Performance analysis compared the proposed ACC-PMUT with traditional PMUTs in single element and array working modes through simulations.
5：Data Analysis Methods:
Data analysis involved numerical simulations to compare displacement amplitude, output power, and frequency responses, with results presented in graphs and equations.
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