研究目的
To describe the fabrication of a CMOS-based imaging chip with monolithically integrated RGB and NIR filters for compact and low-cost multispectral imaging.
研究成果
The paper successfully demonstrates the fabrication of a compact and low-cost spectral sensor by monolithically integrating filters, including a metallic shield and interference filters, on a commercial CMOS image sensor. This approach enables parallel acquisition of RGB and NIR channels with minimized crosstalk, using standard CMOS technology. Future studies could focus on enhancing filter performance and expanding applications in multispectral imaging.
研究不足
The fabrication process relies on outsourcing for RGB color filters and microlenses, which may introduce dependencies. The use of standard CMOS technology might limit customization for specific applications. Potential areas for optimization include improving filter design tunability and reducing crosstalk further.
1：Experimental Design and Method Selection:
The methodology involves monolithically integrating filters on a commercial CMOS image sensor using standard CMOS technology, with a focus on combining interference filters (NIR blocking and bandpass) with polymeric RGB filters and a metallic shield to minimize crosstalk.
2：Sample Selection and Data Sources:
The starting material is a commercial CMOS 200 mm imager wafer (CMOSIS CMV2000) with 2 MP and
3：5 um pixel size. List of Experimental Equipment and Materials:
Equipment includes standard CMOS technology tools in a 200 mm cleanroom, lithography tools, deposition systems for dielectric multilayer stacks and metal layers, dry etch equipment, and outsourcing for RGB color filters and microlenses. Materials include the CMOS wafer, photoresist, dielectric materials for filters, metal for shield, and polymeric color filters.
4：Experimental Procedures and Operational Workflow:
Steps include planarization of the wafer, deposition and patterning of an embedded shield, deposition and patterning of interference filters using lithography and dry etch, final planarization, opening bond-pads, and outsourcing RGB filter and microlens deposition.
5：Data Analysis Methods:
Spectral measurements were executed and analyzed, but specific methods are not detailed in the abstract.
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