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- 摘要
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- 实验方案
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Fluorinated graphene suspension for flexible and printed electronics: Flakes, 2D films, and heterostructures
摘要： Fluorinated graphene (FG), the most stable derivative of graphene, is suggested for the role of functional material (weak fluorination degree) and the dielectric layers for graphene and other 2D materials, especially for flexible and printed electronics. The main findings discussed in the present study are (1) an excellent mechanical properties of FG in bending conditions for the first time measured for FG with different fluorination degree; (2) the 97–99% transparency of FG films with thickness up to 25 nm in wide range of wavelengths, (3) a ultralow leakage current and a high breakdown field in the printed cross-bar structures; (4) a smooth increase in interplanar spacing by 1–2% from the center of few-layered fluorinated graphene flakes to their edges; (5) observation of only C\C related G line without defect related D line in Raman spectra in the case of giant amplification of Raman scattering for FG films printed at Ag layers. Unchanged characteristics of fluorinated graphene films up to stretching-strain values of 2.5–4% were demonstrated. Generally, it can be stated that fluorinated graphene films have great promise in flexible and printed electronics.
关键词： Heterostructures,2D printing techniques,Fluorinated graphene,HREM,FG flexibility
更新于2025-09-23 15:22:29
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Flexible Electronics || Technological Integration in Printed Electronics
摘要： Conventional electronics requires the use of numerous deposition techniques (e.g. chemical vapor deposition, physical vapor deposition, and photolithography) with demanding conditions like ultra-high vacuum, elevated temperature and clean room facilities. In the last decades, printed electronics (PE) has proved the use of standard printing techniques to develop electronic devices with new features such as, large area fabrication, mechanical flexibility, environmental friendliness and—potentially—cost effectiveness. This kind of devices is especially interesting for the popular concept of the Internet of Things (IoT), in which the number of employed electronic devices increases massively. Because of this trend, the cost and environmental impact are gradually becoming a substantial issue. One of the main technological barriers to overcome for PE to be a real competitor in this context, however, is the integration of these non-conventional techniques between each other and the embedding of these devices in standard electronics. This chapter summarizes the advances made in this direction, focusing on the use of different techniques in one process flow and the integration of printed electronics with conventional systems.
关键词： compatibility,final systems,printing techniques,interconnects,process flow
更新于2025-09-10 09:29:36