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[Laser Institute of America ICALEO? 2017: 36th International Congress on Applications of Lasers & Electro-Optics - Atlanta, Georgia, USA (October 22–26, 2017)] International Congress on Applications of Lasers & Electro-Optics - Study on laser multi-focus separation technology for thick KDP crystal
摘要： Potassium dihydrogen phosphate (KDP) crystal is an important electro-optic material in various laser system, and belongs to very difficult-to-cut material, especially for thick crystals. In this study, a laser multi-focus separation technology (LMFS) of thick KDP crystal has been developed by skillfully combining femtosecond laser and LMFS optical system. In this way, the uniformity of temperature and thermal stress distributions along crystal thickness and the utilization efficiency of the laser energy are greatly improved. A penetration crack along crystal thickness could be formed and its propagation direction could be controlled to achieve safe and high-quality separation. The separating thickness of LMFS (50 mm) is at least 4 times thicker than that of existing laser separating technology, and the separating efficiency of LMFS (200 mm/s) is at least 20 times faster than that of traditional mechanical method. The generation mechanism of multi-focus was expounded by optical analysis and design, and verified by an established LMFS optical system. A thick KDP crystal with the thickness of 50 mm was separated successfully by LMFS. The quality of the separated sidewall surface was clean and flat (roughness of 10.857 nm, flatness of 3.5389 mm) without any contamination, underground damage and edge fragmentation. The experimental results proved the feasibility of LMFS, and are in good agreement with the theoretical analysis.
关键词： femtosecond laser,KDP crystal,optical system,laser multi-focus separation technology,thermal stress
更新于2025-09-16 10:30:52
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[IEEE 2019 Compound Semiconductor Week (CSW) - Nara, Japan (2019.5.19-2019.5.23)] 2019 Compound Semiconductor Week (CSW) - Buried tunnel junction current injection for InP-based nanomembrane photonic crystal surface emitting lasers on Silicon
摘要： Microwave backscatter from vegetated surfaces is influenced by vegetation structure and vegetation water content (VWC), which varies with meteorological conditions and moisture in the root zone. Radar backscatter observations are used for many vegetation and soil moisture monitoring applications under the assumption that VWC is constant on short timescales. This research aims to understand how backscatter over agricultural canopies changes in response to diurnal differences in VWC due to water stress. A standard water-cloud model and a two-layer water-cloud model for maize were used to simulate the influence of the observed variations in bulk/leaf/stalk VWC and soil moisture on the various contributions to total backscatter at a range of frequencies, polarizations, and incidence angles. The bulk VWC and leaf VWC were found to change up to 30% and 40%, respectively, on a diurnal basis during water stress and may have a significant effect on radar backscatter. Total backscatter time series are presented to illustrate the simulated diurnal difference in backscatter for different radar frequencies, polarizations, and incidence angles. Results show that backscatter is very sensitive to variations in VWC during water stress, particularly at large incidence angles and higher frequencies. The diurnal variation in total backscatter was dominated by variations in leaf water content, with simulated diurnal differences of up to 4 dB in X- through Ku-bands (8.6–35 GHz). This study highlights a potential source of error in current vegetation and soil monitoring applications and provides insights into the potential use for radar to detect variations in VWC due to water stress.
关键词： Agriculture,vegetation water content (VWC),microwaves,hydrology,water stress,diurnal differences,radar,vegetation
更新于2025-09-16 10:30:52
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A novel method of laser surface hardening treatment inducing different thermal processing condition for Thin-sectioned 100Cr6 steel
摘要： Hardness, microstructure and residual stresses induced on the engineered steel surface have a significant effect on the manufacturing process and the life time of the components. In the present work, these are analysed on laser-treated layer obtained on 100Cr6 bearing steel surface involving different thermal processing conditions. Prior to laser surface hardening treatment, the steel was spheroidized and hardened and tempered with resulting microstructure comprising of globular carbides in the matrix of martensite and retained austenite. A 20-mm wide diode laser beam was employed with a fixed peak laser power in both continuous wave and pulsed wave modes. Additionally, the treatment was carried out with an arrangement to induce fluid contact beneath the workpiece to enhance the heat transfer coefficient. Results indicated maximum improvement in hardness (1050–1100 HV) and compressive residual stress (?630 ± 20 MPa) with retention of core properties on treated surface processed with pulsed-wave mode under fluid contact owing to formation of refined microstructure constituting refined globular carbides (alloy nano-carbides) and retained austenite in martensite matrix. The extent of increase in compressive residual stress and treated layer microhardness was found to depend on the extent of martensite refinement and alloy nano-carbides dispersed in the matrix. Sliding wear tests conducted in both unlubricated and lubricated conditions indicated gradual improvement in wear resistance of the treated surface with increase in cooling rate governed by the thermal processing condition employed with conventionally hardened and tempered one being lowest and laser processed with pulsed wave mode under fluid contact being highest. Apparently, the laser treated surface processed with pulsed-wave mode under fluid contact exhibited reduction in friction coefficient with retention of core properties as compared to untreated counterpart.
关键词： Pulsed-wave,Spheroidized carbides,Laser surface hardening,100Cr6 bearing steel,Residual stress,Continuous-wave
更新于2025-09-16 10:30:52
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Laser-Inscribed Stress-Induced Birefringence of Sapphire
摘要： Birefringence of 3 × 10?3 is demonstrated inside cross-sectional regions of 100 μm, inscribed by axially stretched Bessel-beam-like fs-laser pulses along the c-axis inside sapphire. A high birefringence and retardance of λ/4 at mid-visible spectral range (green) can be achieved using stretched beams with axial extension of 30–40 μm. Chosen conditions of laser-writing ensure that there are no formations of self-organized nano-gratings. This method can be adopted for creation of polarization optical elements and fabrication of spatially varying birefringent patterns for optical vortex generation.
关键词： femtosecond laser,stress,birefringence,sapphire
更新于2025-09-16 10:30:52
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Effects of laser peening on the fatigue strength and defect tolerance of aluminum alloy
摘要： The effects of laser peening (LP) on the bending fatigue strength of the 7075-T651 aluminum alloy were investigated. Accordingly, the defect tolerance of the aluminum alloy subjected to LP is discussed on the basis of fracture mechanics. The results indicate that a deeper compressive residual stress was induced by LP compared with the case of shot peening (SP). The fatigue strengths increased when both peening types were used. Semicircular slits with depths less than 0.4 and 0.1 mm were rendered harmless on the basis of the applications of LP and SP, respectively. The apparent threshold stress intensity factor range ΔKth,ap increased by approximately five and two times owing to LP and SP, respectively. The increase of the ΔKth,ap was caused by the compressive residual stress induced by the peening. The Kitagawa-Takahashi diagram of the laser-peened specimens shows that the defect tolerance of the aluminum alloy was improved by LP.
关键词： fatigue strength,laser peening,residual stress,shot peening,defect tolerance,aluminum alloy
更新于2025-09-16 10:30:52
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Crystal defects in monocrystalline silicon induced by spot laser melting
摘要： Laser processing of monocrystalline silicon has become an important tool for a wide range of applications. Here, we use microsecond spot laser melting as a model experiment to investigate the generation of crystal defects and residual stress. Using Micro-Raman spectroscopy, defect etching, and transmission electron microscopy, we find no dislocations in the recrystallized volume for cooling rates exceeding jdT=dtj ? 2 (cid:2) 107 K/s, and the samples remain free of residual stress. For cooling rates less than jdT=dtj ? 2 (cid:2) 107 K/s, however, the experiments show a sharp transition to a defective microstructure that is rich in dislocations and residual stress. Moreover, transmission electron microscopy indicates dislocation loops, stacking-fault tetrahedra, and voids within the recrystallized volume, thereby indicating supersaturation of intrinsic point defects during recrystallization. Complementing photoluminescence spectroscopy indicates even three regimes with decreasing cooling rate. Spectra of regime 1 do not contain any defect related spectral lines. In regime 2, spectral lines appear related to point defect clusters. In regime 3, the spectral lines related to point defect clusters vanish, but dislocation-related ones appear. We propose a quantitative model explaining the transition from dislocation-free to dislocation-rich recrystallization by means of the interaction between intrinsic point defects and dislocations.
关键词： monocrystalline silicon,transmission electron microscopy,laser melting,micro-Raman spectroscopy,crystal defects,residual stress,photoluminescence spectroscopy
更新于2025-09-16 10:30:52
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In-Fiber Production of Laser-Structured Stress-Mediated Semiconductor Particles
摘要： The ability to generate stressed semiconductor particles is of great importance in the development of tunable semiconductor and photonic devices. However, existing methods including both bottom-up synthesis and top-down fabrication for producing semiconductor particles are inherently free of stress effects. Here, we report a simple approach to generate controllable stress effects on both encapsulated and free-standing semiconductor particles using laser-structured in-fiber materials engineering. The physical mechanism of the thermally induced in-fiber built-in stress is investigated, and the feasibility of precisely tuning the stress state during the particle formation is experimentally demonstrated by controlling the laser treatment. Gigapascal-level built-in stress, which is a sufficiently strong stimulus to enable inelastic deformations on the fabricated semiconductor particles, has been achieved via this approach. Both encapsulated and free-standing stressed semiconductor particles are generated for a wide range of in-fiber and out-fiber optoelectronic and biomedical applications.
关键词： Built-in stress control,Laser cooling rate,Residual stress,Stressed semiconductor particles,In-fiber material engineering
更新于2025-09-12 10:27:22
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[IEEE 2019 8th International Conference on Modeling Simulation and Applied Optimization (ICMSAO) - Manama, Bahrain (2019.4.15-2019.4.17)] 2019 8th International Conference on Modeling Simulation and Applied Optimization (ICMSAO) - Numerical Study of Laser Hole Cutting in Zirconia Toughened Alumina Plate
摘要： The main cause of cracks formation in laser cut holes is due to thermal stress. These formed cracks alter the mechanical properties of work material and degrade the cut hole quality. Therefore thermal analysis of laser cut holes become essential. Laser cutting of structural ceramic possess extra constraints due to their brittle nature. In present paper, laser cutting of hole in Zirconia Toughened Alumina ceramic plate is simulated to investigate the temperature and stress profile. The numerically predicted results show that maximum temperature of 3300 °C is developed near the cut hole region whereas maximum stress of 5 GPa is observed.
关键词： Laser cutting,Zirconia Toughened Alumina,Temperature,Stress
更新于2025-09-12 10:27:22
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Effects of Stress-Relieving Heat Treatment on Impact Toughness of Direct Metal Laser Sintering (DMLS)-Produced Ti6Al4V (ELI) Parts
摘要： The impact toughness of as-built (AB) and stressed-relieved (SR) direct metal laser sintering-produced Ti6Al4V (ELI) was investigated using the standard Charpy impact test over the temperature range of ?130°C to 250°C. Stress-relieving heat treatment was conducted at 650°C for a soaking period of 3 h in argon gas atmosphere. The results showed improvements in the impact toughness after stress-relieving heat treatment. Stress relieving also shifted the established ductile-to-brittle transition temperature to lower temperatures. Comparative analysis of the impact toughness values for AB and SR specimens at ambient temperature showed them to be 48% and 22% lower than recommended values for use in aircraft structures, respectively.
关键词： Impact Toughness,Stress-Relieving Heat Treatment,Ti6Al4V (ELI),Direct Metal Laser Sintering,Charpy Impact Test
更新于2025-09-12 10:27:22
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Residual Stresses in Ultrasonic-Assisted Laser Sintered Grinding Diamond Materials
摘要： Special processing, viz ultrasonic vibration-assisted laser sintering of diamonds was studied. This process would eliminate the drawbacks pertaining to existing super-hard grinding wheels. The composite process fully utilized the odds of laser sintering and ultrasonic vibration to homogenize the structure and reduce residual stresses. Diamond particles were added to a 45 steel matrix using a Ni–Cr alloy via ultrasonic vibration-assisted laser sintering in argon. Metallographic microscopy, and were used to examine the microstructure of a Ni–Cr alloy and abrasive diamond particle bonding interface microstructure, Raman spectrometry was applied to evaluate residual stresses. Acoustic flow and cavitation effects generated by ultrasonic vibration refine crystal grains in the cladding layer and the microstructure is more homogeneous than the microstructure without ultrasonic treatment. A Cr3C2 layer formed on the surface of abrasive diamond particles enhances the bonding ability of a Ni–Cr alloy to diamond, which ensures the diamond isolation and protection, ultrasonic vibration reduces residual stresses inside abrasive diamond particles.
关键词： diamond,laser sintering,ultrasonic vibration,interfacial microstructure,residual stress
更新于2025-09-12 10:27:22