- 标题
- 摘要
- 关键词
- 实验方案
- 产品
-
Conductive treatment of Piezoelectric Composite Material by low-temperature adhesion comparing with ion sputtering
摘要： The surface conductive treatment is an essential step for piezoelectric composite material being application, but until now there are many issues remain to be solved. A conductive adhesion with low curable temperature, low resistivity and high welding spot adhesion strength was obtained for the conductive treatment of piezoelectric composite material. The welding spot adhesion strength was defined at first time. The conductive and adhesion properties were studied comparing with samples treated by ion sputtering. The conductive adhesive with curing agent of EDA has the lowest resistivity of 1.973× 10-4 Ω·cm and the highest welding spot adhesion strength of 7.93MPa.
关键词： Surface conductive treatment,Silver compounds,Adhesive,Piezoelectric Composites
更新于2025-11-21 11:18:25
-
Transmission de l’énergie lumineuse au travers de six marques différentes d’attaches orthodontiques
摘要： Objective: To measure Total Light Energy (TLE) Transmission through six makes of ceramic orthodontic brackets alone and bracket-plus-adhesive samples, using the MARC?-Resin Calibrator (RC). Methods: Six makes, three each monocrystalline (M) and polycrystalline (P) were used; PureSapphire (M), SPA Aesthetic (M), Ghost (M), Mist (P), Reflections (P), and Dual Ceramic (P). The Ortholux? Light Curing Unit (LCU) was used to cure the orthodontic adhesive Transbond?XT. The LCU’s tip irradiance was measured and TLE transmitted through the ceramic bracket was obtained, then adhesive added to the bracket, and transmitted TLE measured through bracket-plus-adhesive samples. The LCU was set at five seconds as recommended for curing adhesive through ceramic brackets. Results: Mean tip irradiance was 1859.2 ± 16.2 mW/cm2. The TLE transmitted through brackets alone ranged 1.7 to 3.9 J/cm2 in the descending order: Ghost > Pure Sapphire > Reflections > Mist > SPA Aesthetics > Dual Ceramic. The TLE transmitted through bracket-plus-adhesive samples ranged 1.6 to 3.7 J/cm2, in the descending order: Ghost > Mist > Reflections > Pure Sapphire > SPA Aesthetics > Dual Ceramic. TLE was reduced with the addition of adhesive (range -0.1 to -0.7 J/cm2). There was a significant difference for Pure Sapphire, Reflections, and Mist (P < 0.05), but not for SPA Aesthetics, Ghost, and Dual Ceramic. There was no overall significant difference between the monocrystalline and polycrystalline makes. The two best makes were of the monocrystalline type, concerning TLE transmission, but with the exception of polycrystalline Dual Ceramic; the next worst make was a monocrystalline bracket, SPA Aesthetics. Conclusion: Light energy attenuation through ceramic orthodontic brackets is make-dependent, with no overall difference between monocrystalline and polycrystalline brackets. Light energy is further attenuated with the addition of resin-based orthodontic adhesive.
关键词： Orthodontic adhesive,Orthodontic bracket,Dental cements,Light curing
更新于2025-09-23 15:23:52
-
[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Integration with Light
摘要： This paper reports the use of Laser-induced Forward Transfer (LIFT) technology for printing of multilayer flexible circuitries and the fabrication of micro-bumps for flip-chip bonding of packaged LEDs and bare die microcomponents. Bonding of passive and functional surface mount devices (SMD) on low-temperature polyethylene terephthalate (PET) foils have been demonstrated using two selective bonding techniques. Firstly, using a high intensity near-infrared (NIR) lamp, a bare die NFC chip was bonded on micro-bumps formed with LIFT printed isotropic conductive adhesive (ICA) within less than a minute. Secondly, using a high intensity Xenon lamp, passive components and packaged LEDs were bonded within 5 seconds on micro-bumps formed with conventional Sn–Ag–Cu (SAC) lead-free alloys. In the both cases, due to selective light absorption, a limited temperature increase was observed in the PET substrates allowing successful bonding of components onto the delicate polyethylene foil substrates using conventional interconnect materials.
关键词： LIFT,low temperature bonding,NIR curing,conductive adhesive,lead-free SAC solder,photonic soldering,flip-chip bonding,laser printing
更新于2025-09-23 15:23:52
-
Physico-mechanical and antimicrobial properties of an orthodontic adhesive containing cationic curcumin doped zinc oxide nanoparticles subjected to photodynamic therapy
摘要： Background: Potential complications on the crown level during fixed orthodontic procedures are white spot, enamel demineralization and the tooth decay. This study evaluated the antimicrobial properties of an orthodontic adhesive incorporating cationic curcumin doped zinc oxide nanoparticles (cCur/ZnONPs), which can have the highest concentration of cCur/ZnONPs and shear bond strength (SBS) value simultaneously, on the against cariogenic bacteria including Streptococcus mutans, Streptococcus sobrinus, and Lactobacillus acidophilus. Materials and methods: Following synthesis and confirmation of cCur/ZnONPs, SBS and adhesive remnant index (ARI) of the test adhesives containing cCur/ZnONPs (1.2, 2.5, 5, 7.5, and 10% wt.) were measured using universal testing machine and stereomicroscope, respectively. After continuously rinsed (up to 180 day), the residual antimicrobial ability of modified adhesives which can have the highest concentration of cCur/ZnONPs and SBS value simultaneously were determined by disc agar diffusion (DAD), biofilm formation inhibition, and metabolic activity assays following photo-activation using light-emitting diode (LED) for 5 min against multispecies cariogenic biofilm-producing bacteria. Results: Adhesive with 7.5% wt. cCur/ZnONPs showed the highest concentration of cCur/ZnONPs and SBS value (14.89 ± 3.26 MPa, P < 0.05) simultaneously. No significant differences in ARI scores were found between the modified adhesive and control (Transbond XT without the cCur/ZnONPs). 7.5% wt. cCur/ZnONPs following photo-activation was not colonized by the test microorganisms and suppressed 100% metabolic activity of the test microorganisms up to 90 day compared to the control group (cCur/ZnONPs free LED irradiation; P < 0.05). In DAD assay, the reduction of photodynamic disinfection of the 7.5% wt. cCur/ZnONPs against test bacteria was positively associated to the time, in such a way that it was decreased significantly after 60 day. From days 120 onwards, microbial biofilm formation and metabolic activity was progressively increased on 7.5% wt. cCur/ZnONPs adhesive discs compared to the control group (cCur/ZnONPs free LED irradiation). Conclusions: Our findings highlight the photo-activated 7.5% wt. cCur/ZnONPs can serve as an orthodontic adhesive additive for control the cariogenic multispecies biofilm, and also to reduce their metabolic activity.
关键词： Cariogenic bacteria,Orthodontic adhesive,Antimicrobial photodynamic therapy,Cationic curcumin,Zinc oxide nanoparticles
更新于2025-09-23 15:23:52
-
[IEEE 2018 International Conference on Applied Engineering (ICAE) - Batam, Indonesia (2018.10.3-2018.10.4)] 2018 International Conference on Applied Engineering (ICAE) - Epoxy Adhesive as Die Attach Material in Semiconductor Packaging: A Review
摘要： Semiconductor packaging generally includes many steps such as wafer mounting, wafer dicing, die attach or die bonding, wire bonding, molding, plating, marking, and trim form. Die attach process is one of the crucial process in electronics packaging or semiconductor packaging. So, the die attaches material is an important part of this process. Die attach materials are commonly divided into some categories. The categories cover high and low-temperature application. Some kinds of die attach materials are alternative resins, epoxy adhesive, soft soldering, die attach solders and silver-glass material. In this study focuses to review epoxy adhesive material in die attach process.
关键词： epoxy adhesive material,die attach,semiconductor packaging,material characterization
更新于2025-09-23 15:22:29
-
Numerical and experimental analysis of the effect of metal tie layers on improving electrical properties of gold coated poly (dimethylsiloxane) flexible multi-layered films during folding
摘要： To improve folding electrical properties of flexible electronics, this study presents a new adhesive stress analysis of depositing an adhesion layer between the conductive film electrode and the flexible substrate during folding test by a folding test platform. The folding test platform controls folding curvature of the flexible conductive substrates, folding times, and velocities in this study. Moreover, the electrical properties of flexible conductive substrates are measured during folding testing by the folding test platform. Eventually, this study successfully analyzes residual strain, adhesive stress, and electrical properties of flexible gold coated on polydimethylsiloxane substrates with chromium, nickel, and titanium adhesion layers up to 0.5/cm folding curvature during folding testing. The chromium adhesion layer had the best performance based on the largest adhesive stress, only 3.74 X resistance increase and 4.53 X maximum resistance up to 0.5/cm folding curvature during folding test by a folding test platform. The experimental result with chromium adhesion layer is consistent with adhesive stress analysis and provides a better adhesive strength between gold and polydimethylsiloxane than nickel and titanium materials for folding test. Therefore, adhesive stress analysis is adapted to evaluate the foldable electronics performance for improving folding characteristics easier.
关键词： flexible electronics,Folding electrical property,folding test platform,adhesive stress analysis,adhesion layer
更新于2025-09-23 15:22:29
-
Fluorescence detection test by black printed circuit board based microfluidic channel for polymerase chain reaction
摘要： This paper proposes the optimal structure of a PCB-based micro PCR chip constructed on a PCB substrate using commercial adhesive tapes and plastic covers. The solder mask of the PCB substrate was coated black, and the area where the reaction chamber is attached was legend printed with white silk to minimize the noise during fluorescence detection. The performance of the PCR and fluorescence detection was compared using 6 types of reaction chambers, each made with different double-sided tapes. Three of the chambers were unsuccessful in completing the PCR. The performance of the other three chambers that successfully amplified DNA was compared using Taqman probe for Chlamydia Trachomatis DNA. The amplified product was illuminated diagonally with a blue LED to excite the product just before imaging, and the LED was turned off when the image was captured to prevent quenching of the probe. The images were taken 10 seconds prior to the last extension step for each cycle using a DSLR camera. The experiments were run as a quartet for each three chambers made with different double-sided tape. The results showed that there were significant difference between the three tapes.
关键词： microfluidic channel,polymerase chain reaction,fluorescence detection test,acrylic adhesive,micro-PCR chip,black PCB,double-sided tape
更新于2025-09-23 15:22:29
-
Preparation and characterization of UV-curable fluorine-silicon block urethane acrylates for application in release films
摘要： A series of fluorine-silicon block urethane acrylates (PSi-FMPG-IPDI-HEMA) were synthesized from hydroxypropyl-terminated polysiloxane (PSi), newly-prepared fluorodiol (FMPG), isophorone diisocyanate (IPDI) and hydroxyethyl methacrylate (HEMA). Their molecular structures were characterized by Fourier transform infrared and gel permeation chromatography. The compatibility of the oligomers with HFMA was validated using UV–vis transmittance analysis. The thermal stability, water and chemical resistance, contact angles and anti-adhesive performance of the films were measured. It was found all the films had good thermal properties, and excellent water and chemical resistance. The FMPG content affected the surface energy and anti-adhesive performance of the films. The films with more FMPG presented lower surface energy, lower peel strength, and higher residual adhesion. More importantly, the release films designed based on the fluorine-silicon block urethane acrylates had tremendous application potential.
关键词： Anti-adhesive performance,Surface energy,Fluorine-silicon block urethane acrylates,Thermal stability
更新于2025-09-23 15:22:29
-
Surface engineering of a titanium alloy for tribological applications by nanosecond-pulsed laser
摘要： In many applications, surface engineering is needed in order to overcome the poor wear properties of titanium alloys. A fiber laser was used in different operation modes for remelting a Ti6Al4V surface and subsequently smoothing it again, resulting in a smooth, glossy and crack-free surface. The laser treated surface was characterized by tribological experiments, nanoindentation and (transmission) electron microscopy and compared to samples treated by plasma nitridation and thermal oxidation. All surface treatments improved the tribological behavior of Ti6Al4V to different extents. Nanoindentation measurements showed no strict correlation of mechanical properties and tribological behavior. It is hypothesized that apart from mechanical properties, binding of titanium electrons by interstitials plays a role in the occurrence or absence of adhesive wear.
关键词： Titanium alloys,Surface engineering,Adhesive wear,Ti6Al4V
更新于2025-09-23 15:21:01
-
Effects of 445-nm Diode Laser-Assisted Debonding of Metallic Brackets on Shear Bond Strength and Enamel Surface Morphology
摘要： Objective: To evaluate the effect of a 445-nm diode laser on the shear bond strength (SBS) of metallic brackets before debonding. Background: Due to the new blue laser technology, very few studies are available in this context. Methods: Seventy metallic brackets (Discovery; Dentaurum, Ispringen, Germany) were bonded to the frontal enamel surfaces of 70 caries-free bovine incisors in a standardized way. Each sample was randomly assigned to the control or laser group, with 35 samples per group. The brackets in the laser group were irradiated with the diode laser (SIROLaser Blue(cid:2); Sirona, Bensheim, Germany) on three sides of the bracket bases for 5 s each (lateral–coronal–lateral, a total of 15 s) immediately before debonding. SBS values were evaluated for the control group and laser group. Micrographs of the enamel surface were taken with 10 · magni?cation to assess the adhesive remnant index (ARI) and the degree of enamel fractures after debonding. Results: There were no statistically signi?cant differences in SBS in the laser group in comparison with the control group ( p > 0.05). The distribution of ARI scores was also not statistically signi?cantly different in the laser group in comparison with the control group ( p > 0.05). Three enamel fractures occurred in the control group and one in the laser group after debonding. Conclusions: Irradiation of metallic brackets with the 445-nm diode laser before debonding does not signi?cantly reduce the SBS values and does not in?uence the remaining amount of adhesive on the enamel surface. The risk of enamel fractures during debonding is therefore not clinically affected.
关键词： adhesive remnant index,orthodontics,metallic bracket debonding,445-nm diode laser
更新于2025-09-23 15:21:01