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Contactless parametric characterization of bandgap engineering in p-type FinFETs using spectral photon emission
摘要： In the last decade it has become increasingly popular to use germanium enriched silicon in modern field effect transistors (FET) due to the higher intrinsic mobility of both holes and electrons in SiGe as compared to Si. Whether used in the source/drain region (S/D) as compressive stressor, which is an efficient mobility booster on Si channel devices, or as channel material, the SiGe increases channel carrier mobility and thus enhancing device performance. Because the germanium content modifies the effective bandgap energy EG, this material characteristic is an important technology performance parameter. The bandgap energy can be determined in an LED-like operation of electronic devices, requiring forward biased p-n junctions. P-n junctions in FETs are source or drain to body diodes, usually grounded or reversely biased. This investigation applies a bias to the body that can trigger parasitic forward operation of the source/drain to body p-n junction in any FET. Spectral photon emission (SPE) is used here as a non-destructive method to characterize engineered bandgaps in operative transistor devices, while the device remains fully functional. Before applying the presented technique to a p-type FinFET device, it is put to the proof by verifying the nominal silicon bandgap on an (unstrained) 120 nm technology FET. Subsequently the characterization capability for bandgap engineering is then successfully demonstrated on a SiGe:C heterojunction bipolar transistor (HBT). In a final step, the bandgap energy EG of a 14/16 nm p-type FinFET was determined to be 0.84 eV, which corresponds to a Si0.7Ge0.3 mixture. The presented characterization technique is a contactless fault isolation method that allows for quantitative local investigation of engineered bandgaps in p-type FinFETs.
关键词： p-n junction,Heterojunction bipolar transistor,Bandgap characterization,p-channel FinFET,SiGe, strained Si,Body diode, parasitic operation,Bandgap engineering,Body bias voltage,HBT,Contactless fault isolation,Spectral photon emission,MOSFET
更新于2025-09-23 15:23:52
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[IEEE 2018 IEEE Energy Conversion Congress and Exposition (ECCE) - Portland, OR, USA (2018.9.23-2018.9.27)] 2018 IEEE Energy Conversion Congress and Exposition (ECCE) - Comparison Study of Surge Current Capability of Body Diode of SiC MOSFET and SiC Schottky Diode
摘要： The superior performance of the SiC MOSFETs operating in synchronous mode converter without external antiparallel SiC Schottky diodes have been demonstrated recently. However, there are few studies of the surge current capability of the SiC MOSFET's body diode, leading severe concern for its ruggedness in practical power converter applications. The purpose of this paper is to experimentally compare the non-repetitive surge current capability of the SiC MOSFET's intrinsic body diode and SiC Schottky diode, and analyze the physical mechanisms of their degradation after surge current stress. Their surge current capability and electrical characteristics before and after surge current stress are measured and analyzed. Experimental study shows that the non-repetitive peak surge current of the SiC MOSFET’s body diode is slightly larger than that of the SiC Schottky diodes. The degradation of the SiC Schottky diode after surge current stress is accompanied with the increase of drain leakage current, while the degradation of the SiC MOSFET after the body diode’s surge current stress is accompanied with the variation of the threshold voltage and input capacitance of the SiC MOSFET. The analysis shows that the degradation of the SiC MOSFET after the surge current stress may be correlated with the interface traps of SiC/SiO2 interface.
关键词： Body diode,SiC Schottky Diode,SiC MOSFET,Surge current
更新于2025-09-23 15:22:29
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Online Junction Temperature Extraction of SiC Power MOSFETs with Temperature Sensitive Optic Parameter (TSOP) Approach
摘要： Accurate information of the junction temperature of SiC power MOSFETs ensures safe operation and helps reliability assessment of the devices. In this paper, an online junction temperature extraction method is proposed based on the electroluminescence phenomenon of the body diode of SiC power MOSFETs. It is found that during the forward conduction interval of the body diode, visible blue light is emitted around the chip, which ascribes to the radiative recombination in the low doped region of SiC MOSFETs. Experimental results suggest the light intensity changes linearly with the variation of the temperature and behaves as a temperature sensitive optic parameter (TSOP). Further, an electro-thermal-optic model is proposed to reveal the relationship between electroluminescence intensity, forward current and junction temperature. Based on the TSOP, an online junction temperature extraction method is proposed for SiC MOSFETs and verified in a SiC MOSFET based inverter. Compared with state-of-the-art methods, the proposed junction temperature measurement method is contactless and immune from the aging of the package.
关键词： junction temperature extraction,Body diode,thermal management,electroluminescence,SiC MOSFETs
更新于2025-09-23 15:22:29
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[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Characterization of Bandgap Engineering on Operative Transistor Devices by Spectral Photon Emission
摘要： In modern IC technologies, it is very common to use germanium enriched silicon in order to increase field effect transistor (FET) channel carrier mobility for high performance. The germanium content modifies the effective semiconductor band gap EG. Thus, the bandgap energy EG is an important technology performance parameter. EG can be obtained in an LED-like operation of electronic devices, requiring forward biased p-n junctions. P-n junctions in FETs are source or drain to body diodes, usually grounded or reversely biased. This investigation applies a bias to the body that can trigger parasitic forward operation of the source/drain to body p-n junction in any FET. Spectral photon emission (SPE) is taken here as non-destructive in operative method to characterize engineered bandgaps transistor devices, while the device remains fully functional. Proving this technique with the nominal silicon bandgap on an (unstrained) 120nm technology FET, the characterization capability for bandgap engineering is successfully demonstrated using SiGe:C HBT. In IC technology, Ge enriched silicon is recently often used to increase channel carrier mobility. As a next step, 14/16nm p-type FinFET devices have been investigated by applying a bias voltage to the body and thereby activating one of the body/diffusion p-n junctions in forward bias. By measuring the spectral distribution of emission intensity through the backside of the operating device with an InGaAs detector, EG of the engineered bandgap can be determined in the FinFETs as well, in case of the investigated p-type FinFETs to 0.84 eV. This opens a new path for contactless fault isolation by quantitative local determination of bandgap engineering.
关键词： Bandgap engineering,body diode,heterojunction bipolar transistor,body bias voltage,contactless fault isolation,parasitic operation,FinFET,germanium,MOSFET,p-n junction,bandgap characterization,spectral photon emission,SiGe,HBT
更新于2025-09-04 15:30:14