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oe1(光电查) - 科学论文

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出版时间
  • 2018
研究主题
  • Flexible display
  • fabrication process
  • electrowetting
  • PEN substrate
应用领域
  • Optoelectronic Information Science and Engineering
机构单位
  • South China Normal University
400 条数据
?? 中文（中国） ▾

  • Carbon Nanotube Thin Films for High-Performance Flexible Electronics Applications

    摘要： Carbon nanotube thin films have attracted considerable attention because of their potential use in flexible/stretchable electronics applications, such as flexible displays and wearable health monitoring devices. Due to recent progress in the post-purification processes of carbon nanotubes, high-purity semiconducting carbon nanotubes can be obtained for thin-film transistor applications. One of the key challenges for the practical use of carbon nanotube thin-film transistors is the thin-film formation technology, which is required for achieving not only high performance but also uniform device characteristics. In this paper, after describing the fundamental thin-film formation techniques, we review the recent progress of thin-film formation technologies for carbon nanotube-based flexible electronics.

    关键词： Flexible electronics,Carbon nanotube,Thin film

    更新于2025-09-23 15:23:52

  • Three-dimensional monolithic integration in flexible printed organic transistors

    摘要： Direct printing of thin-film transistors has enormous potential for ubiquitous and lightweight wearable electronic applications. However, advances in printed integrated circuits remain very rare. Here we present a three-dimensional (3D) integration approach to achieve technology scaling in printed transistor density, analogous to Moore’s law driven by lithography, as well as enhancing device performance. To provide a proof of principle for the approach, we demonstrate the scalable 3D integration of dual-gate organic transistors on plastic foil by printing with high yield, uniformity, and year-long stability. In addition, the 3D stacking of three complementary transistors enables us to propose a programmable 3D logic array as a new route to design printed flexible digital circuitry essential for the emerging applications. The 3D monolithic integration strategy demonstrated here is applicable to other emerging printable materials, such as carbon nanotubes, oxide semiconductors and 2D semiconducting materials.

    关键词： printed electronics,organic transistors,3D integration,dual-gate transistors,flexible circuits

    更新于2025-09-23 15:22:29

  • [IEEE 2018 International Flexible Electronics Technology Conference (IFETC) - Ottawa, ON, Canada (2018.8.7-2018.8.9)] 2018 International Flexible Electronics Technology Conference (IFETC) - Deformable User Interfaces: Using Flexible Electronics for Human Computer Interaction

    摘要： Deformable inputs offer users the ability to physically manipulate a device for system interaction. We combine flexible electronic technologies with human computer interaction to study how changing the form factor of digital devices can offer new interaction techniques to users. We introduce our research on deformable user interfaces by discussing bend gestures as a source of input, presenting our process to rapidly prototype flexible devices, and demonstrate three deformable user interfaces: bend passwords, bend for mobile games, and bend for vision impaired users. We show how flexible devices and deformable interactions can improve how we interact with our devices.

    关键词： Human Computer Interaction,Flexible Electronics,Deformable User Interfaces

    更新于2025-09-23 15:22:29

  • [IEEE 2018 International Flexible Electronics Technology Conference (IFETC) - Ottawa, ON, Canada (2018.8.7-2018.8.9)] 2018 International Flexible Electronics Technology Conference (IFETC) - Screen Printed Vias for a Flexible Energy Harvesting and Storage Module

    摘要： This case study evaluates a highly flexible screen printed through-hole-via using silver microparticle inks for applications in energy harvesting and storage modules. The printed vias fabrication and reliability are evaluated by means of a double sided screen-printing method and repetitive (cyclic) bending tests. Vias, in 125 μm thick PET, were laser cut (50, 100, 150, and 200 μm nominal diameter) then filled, and simultaneously connected to adjacent vias, by screen printing. To investigate the use of the printed via in a monolithic energy module, the vias were used for the fabrication of a flexible printed supercapacitor (aqueous electrolyte and carbon electrode). The results indicate that the lower viscosity silver ink (DuPont 5064H) does not fill the via as effectively as the higher viscosity ink (Asahi LS411AW), and only the sidewall of the via Conversely, the Asahi silver paste fills the via more thoroughly and exhibited a 100 % yield (1010 vias; 100 μm nominal via diameter) with the 2-step direct screen-printing method. The bending test showed no signs of via specific breakdown after 30 000 cycles. The results indicate that this via filling process is likely compatible with roll-to-roll screen printing to enable multi-layered printed electronics devices.

    关键词： flexible and printed electronics,screen printing,printed vias,bending reliability,energy module

    更新于2025-09-23 15:22:29

  • [IEEE 2018 International Flexible Electronics Technology Conference (IFETC) - Ottawa, ON, Canada (2018.8.7-2018.8.9)] 2018 International Flexible Electronics Technology Conference (IFETC) - Low Temperature (80 °C) Sinterable Particle Free Silver Ink for Flexible Electronics

    摘要： For the emerging field of flexible printed electronics, ink compatibility with substrate is always required. However, most of the commercial silver nanoparticle-based inks are not compatible with flexible substrates, as they need high- sintering temperatures (~150-250 0C). In addition, silver nanoparticle-based inks have several serious problems such as a complex synthesis protocol, high cost, particle aggregation, nozzle clogging, reduced shelf life, and jetting instability. These shortcomings in conductive inks are barriers for their wide spread use in practical applications. In this work, we demonstrate a silver-organo-complex (SOC) based particle free silver ink which can decompose at 80 0C and becomes conductive at this low temperature. The inkjet-printed film from this ink exhibits not only high conductivity but also excellent jetting and storage stability. To demonstrate the suitability of this ink for flexible electronics, an inkjet-printed film on flexible polyimide substrate is subjected to bending and crushing tests. The results before and after flexing and crushing are very similar, thus verifying the excellent tolerance against bending and crushing for this ink as compared to the commercial nanoparticles based ink.

    关键词： low-temperature sintering,silver-organo-complex (SOC) ink,bending and crushing test,inkjet-printing,flexible

    更新于2025-09-23 15:22:29

  • Numerical and experimental analysis of the effect of metal tie layers on improving electrical properties of gold coated poly (dimethylsiloxane) flexible multi-layered films during folding

    摘要： To improve folding electrical properties of flexible electronics, this study presents a new adhesive stress analysis of depositing an adhesion layer between the conductive film electrode and the flexible substrate during folding test by a folding test platform. The folding test platform controls folding curvature of the flexible conductive substrates, folding times, and velocities in this study. Moreover, the electrical properties of flexible conductive substrates are measured during folding testing by the folding test platform. Eventually, this study successfully analyzes residual strain, adhesive stress, and electrical properties of flexible gold coated on polydimethylsiloxane substrates with chromium, nickel, and titanium adhesion layers up to 0.5/cm folding curvature during folding testing. The chromium adhesion layer had the best performance based on the largest adhesive stress, only 3.74 X resistance increase and 4.53 X maximum resistance up to 0.5/cm folding curvature during folding test by a folding test platform. The experimental result with chromium adhesion layer is consistent with adhesive stress analysis and provides a better adhesive strength between gold and polydimethylsiloxane than nickel and titanium materials for folding test. Therefore, adhesive stress analysis is adapted to evaluate the foldable electronics performance for improving folding characteristics easier.

    关键词： flexible electronics,Folding electrical property,folding test platform,adhesive stress analysis,adhesion layer

    更新于2025-09-23 15:22:29

  • Silver Nanowires Inks for Flexible Circuit on Photographic Paper Substrate

    摘要： Silver nanowires (AgNWs) have inspired many research interests due to their better properties in optical, electric, and flexible applications. One such exploitable use is as the electrical conductive fillers for print electronics. In this paper, AgNWs with mean a diameter of 80 nm and mean length of 13.49 μm were synthesized using the polyol solvothermal method. A sonication-induced scission process was used to obtain AgNWs with a length range of 7.64–11.21 μm. Further AgNWs inks were prepared with the as-synthesized AgNWs as conductive fillers in anhydrous ethanol. The conductive inks were coated on resin coated photographic paper substrate using the knife coating process and dried at room temperature. The effects of the number of layers of AgNWs coating, the concentration of AgNWs, and the length of AgNWs on the microstructure and electrical properties of samples were investigated by scanning electron microscopy and using the four-point probe method. The results show that the conductivity of the AgNWs coating increases with the increase in the number of layers in the AgNWs coating, concentration and length of the AgNWs.

    关键词： sheet resistance,silver nanowires inks,flexible circuit,photographic paper

    更新于2025-09-23 15:22:29

  • [IEEE 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) - Singapore, Singapore (2018.4.22-2018.4.26)] 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) - Self-Powered, High-Sensitive Human Cutaneous Activities Sensor

    摘要： A self-powered piezoelectric sensor based on lead-free (K,Na)NbO3 (KNN) thin film for human health monitoring is presented. The sensor is fabricated on a flexible substrate and exhibits high sensitivity and stability. It can detect various physiological signals such as pulse, respiration, and body movement. The results demonstrate its potential for wearable health monitoring applications.

    关键词： piezoelectric sensor,KNN thin film,health monitoring,lead-free,flexible substrate,wearable

    更新于2025-09-23 15:22:29

  • Tailorable and Flexible Conducting Films via Interfacial Modification of Polymer Fibers

    摘要： Portable devices have become lightweight, flexible, and even stretchable such that skin-like electronics are widely applicable, including in biomedical devices, soft robotics, and human/machine interfaces. Rendering these devices soft and flexible is highly desirable, as this would enable them to interact seamlessly with human skin and improve their wearing comfort. We demonstrate a convenient but effective method to fabricate flexible conducting films. These films consist of electrospun polyurethane (PU) fibers as the flexible substrate onto which copper was deposited. These Cu-PU films have excellent conductivity, and their resistance only increases slightly after extensive folding, even when folded into a paper crane with a resistance of 1.8 Ω. Furthermore, Cu-PU films can sense tension strength and exhibit stable Joule electrothermal performance. The Cu-PU-based heating glove could be heated to 40 °C in 30 s by applying 2 V. The simple but effective procedure presented here is suitable to fabricate flexible conducting film and may also promote the development of portable and flexible electronic products.

    关键词： flexible,polymer fiber,strain sensor,conductive,interfacial modification

    更新于2025-09-23 15:22:29

  • [IEEE 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Qingdao, China (2018.10.31-2018.11.3)] 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Design of a flexible MEMS pressure sensor array in dog’s artificial knee joint

    摘要： This paper proposed a novel design of flexible sensor array which can be applied to measure the pressure distribution in the dog’s artificial knee joint after the Total Knee Arthroplasty(TKA). Using MEMS technology, the flexible sensor array mainly consists of 100 sensing points which are fabricated based on SOI, and spin-coated polyimide(PI) films. It is strongly attached to the surface of polyethylene insert in the dog’s artificial knee joint. The flexible MEMS sensor array is biocompatible for vivo animal experiment and expected to play an important role in the research of improving the surgery effect of TKA.

    关键词： flexible pressure sensor,MEMS,artificial knee joint

    更新于2025-09-23 15:22:29