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[IEEE 2019 IEEE/ACM Workshop on Photonics-Optics Technology Oriented Networking, Information and Computing Systems (PHOTONICS) - Denver, CO, USA (2019.11.18-2019.11.18)] 2019 IEEE/ACM Workshop on Photonics-Optics Technology Oriented Networking, Information and Computing Systems (PHOTONICS) - An Optical Neural Network Architecture based on Highly Parallelized WDM-Multiplier-Accumulator
摘要： Future applications such as anomaly detection in a network and autonomous driving require extremely low, sub-microsecond latency processing in pattern classification. Towards the realization of such an ultra-fast inference processing, this paper proposes an optical neural network architecture which can classify anomaly patterns at sub-nanosecond latency. The architecture fully exploits optical parallelism of lights using wavelength division multiplexing (WDM) in vector-matrix multiplication. It also exploits a linear optics with passive nanophotonic devices such as microring resonators, optical combiners, and passive couplers, which make it possible to construct low power and ultra-low latency optical neural networks. Optoelectronic circuit simulation using optical circuit implementation of multi-layer perceptron (MLP) demonstrates sub-nanosecond processing of optical neural network.
关键词： optical neural network,wavelength division multiplexing,multi-layer perceptron
更新于2025-09-16 10:30:52
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Response Properties of Gold- and Aluminum-deposited SPR-based Glass Rod Sensors Using Light-emitting Diodes with Various Wavelengths; 各種波長の発光ダイオードを用いる金とアルミニウムを蒸着したガラス棒SPRセンサーの応答特性;
摘要： The response curves of gold (Au)- and aluminum (Al)-deposited surface plasmon resonance (SPR)-based glass rod sensors with various light-emitting diodes (LEDs) of visible and near-infrared emission as the light sources were measured. Au films with thicknesses of 30, 45, and 70 nm, and Al films with thicknesses of 15, 30, and 45 nm were deposited on half of the surfaces of glass rods of 2 mm in diameter with a deposition length of 100 mm. The LEDs of blue (464 nm), green (533 nm), yellow (591 nm), red (654 nm), and near-infrared (934 nm) emissions for Au films, and those of violet (402 nm), blue, green, yellow, red emissions for Al were used. The response curves of these sensors, calculated using a multi-layer Fresnel equation using various dielectric constants for the emission wavelengths reported in literatures, were compared with those obtained in the measurements. The important parameters for the calculations were the LED intensity distribution, the range of the angle of incidence of light into the sensor element, and the thickness distributions of the metal films deposited on the glass rods. Native oxide layers with a thickness of 3.0 nm were considered for Al films. The minimum positions of the experimental response curves agreed well with those of the theoretical response curves within the limits of the experimental uncertainties, though those of the experimental response curves using the LED of near-infrared emission shifted to higher refractivity values, mainly due to the wide wavelength distribution to longer wavelengths of the LED. The agreements between the experimental and theoretical response curves indicate both the potential and the usefulness of the sensor performance estimation process based on the multi-layer Fresnel equation. It was also found that the value of the ratio of the real and imaginary part of the dielectric constant is an easy and useful estimation for SPR.
关键词： multi-layer Fresnel equation,dielectric constant,Au,metal-deposited SPR-based glass rod sensor,Al
更新于2025-09-16 10:30:52
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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Multi-physics Modelling and Experimental Investigation – An Original Approach for Laser-Dicing/Grooving Process Optimization
摘要： The highly complex technology requirements of today’s integrated circuits (ICs), lead to the increasingly use of several materials types such as metal structures, brittle dielectrics, porous low-k and ultra-low-k materials which are used in both front-end-of-line (FEOL) and back-end-of-line (BEOL) process for wafer manufacturing. In order to singulate chips from wafers, a critical laser-grooving process, prior to blade dicing, is used to remove these layers of materials out of the dicing street. The combination of laser-grooving and blade dicing allows to reduce the potential risk of induced mechanical defects such micro-cracks, chipping, on the wafer top surface where circuitry is located. Nevertheless, challenges related to unexpected drawbacks on process such as efficiency, quality and reliability still remain. To maximize control of this critical process and reduce its undesirable effects, numerical models of nanosecond laser pulsed and multi-stack material interaction have been developed. The modeling strategy using finite elements formalism is based on the convergence of two approaches, numerical and experimental Validation. To evaluate this interaction, several laser grooved samples were performed using IBM 14 nm technology node wafer and were correlated with finite elements modeling. Three different aspects were studied; phase change, thermo-mechanical and optical sensitive parameters. The numerical model makes it possible to simulate groove profile (depth, width, etc.) of a single pulse or multi-pulses on BEOL wafer material. Moreover, the heat-affected zone (HAZ) has been estimated as a function of laser operating parameters (power, frequency, spot size, defocus, speed, etc.). After modeling validation and calibration, a reasonable agreement between experiment and modeling results has been observed in terms of groove depth, width and HAZ.
关键词： Laser-dicing,wafer back-end-of-line,multi-stacks,multiphysics modeling,nano-second pulsed laser,multi-layer
更新于2025-09-12 10:27:22
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[IEEE 2019 International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM) - Qingdao, China (2019.9.18-2019.9.20)] 2019 International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM) - Design of Hollow Waveguide to Substrate Integrated Waveguide Transition in Multi-layer Substrate
摘要： Substrate Integrated Waveguide (SIW) is a low loss transmission line which can be used to connect an antenna to a backed RF circuit in the millimeter wave band. A multi-layer substrate is effective to integrate RF circuits and antennas. Therefore, a transition between a hollow waveguide and a SIW in multi-layer substrate is necessary. However, reflection loss generates at the connections between the hollow waveguide and the SIW in each layer. In this study, a back short and window structures are proposed to use for matching circuit in the transition. Transitions from hollow waveguide to SIWs in multi-layer substrate were designed for low loss over wide bandwidth.
关键词： Substrate Integrated Waveguide (SIW),millimeter wave band,multi-layer substrate,transition
更新于2025-09-12 10:27:22
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[IEEE 2019 34th Symposium on Microelectronics Technology and Devices (SBMicro) - Sao Paulo, Brazil (2019.8.26-2019.8.30)] 2019 34th Symposium on Microelectronics Technology and Devices (SBMicro) - Multi-layers Lateral SOI PIN Photodiodes for Solar Cells Applications
摘要： In this paper, a lateral PIN photodiode based on a SOI wafer has been studied through numerical simulations. This device can be used as a solar cell embedded in a CMOS circuit in order to propose autonomous ultralow-power circuits (ULP). Efficiency behavior has been analyzed for different semiconductor materials and configurations in order to reach the best performance. The results indicate that a layer with a different semiconductor, with different characteristics such as forbidden band, mobility and light absorption, improves the generated power in the device, suggesting that the cell can feed circuits that need larger power.
关键词： PIN photodiode,Solar cells,Multi-layer,Germanium
更新于2025-09-12 10:27:22
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A near-vertical approach to Laser Narrow Gap Multi-Layer Welding
摘要： A novel, near-vertical approach to the usually horizontal laser Narrow Gap Multi-Layer Welding process is introduced. The process is applied to join X100 pipeline steel and studied through High Speed Imaging. The produced welded joints are compared to their horizontally welded counterparts using 3D scanning, longitudinal & perpendicular cross sections and Computed Tomography analysis. The near-vertical approach is found to be robust and produce welded joints with a uniform appearance. The top surface exhibits certain reoccurring morphological features, and variations in internal track melting boundaries are observed. Any observed cavities appear similar to those produced using the horizontal process, with the difference of their orientation. A combination of the horizontal and the near-vertical process could be beneficial; the near-vertical approach offers potential for shorter inter-layer time and the horizontal method for better surface finish than that of its counterpart. Potential benefits of, and improvements to, the near-vertical process are discussed.
关键词： Vertical welding,Filler wire,Narrow Gap,Multi-layer,Laser welding
更新于2025-09-12 10:27:22
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Microcavity characteristics analysis of micro-shuttered organic light-emitting diodes
摘要： We propose a designing of multi-layer neural networks using 2D NAND flash memory cell as a high-density and reliable synaptic device. Our operation scheme eliminates the waste of NAND flash cells and allows analogue input values. A 3-layer perceptron network with 40,545 synapses is trained on a MNIST database set using an adaptive weight update method for hardware-based multi-layer neural networks. The conductance response of NAND flash cells is measured and it is shown that the unidirectional conductance response is suitable for implementing multi-layer neural networks using NAND flash memory cells as synaptic devices. Using an online-learning, we obtained higher learning accuracy with NAND synaptic devices compared to that with a memristor-based synapse regardless of weight update methods. Using an adaptive weight update method based on a unidirectional conductance response, we obtained a 94.19% learning accuracy with NAND synaptic devices. This accuracy is comparable to 94.69% obtained by synapses based on the ideal perfect linear device. Therefore, NAND flash memory which is mature technology and has great advantage in cell density can be a promising synaptic device for implementing high-density multi-layer neural networks.
关键词： synaptic device,multi-layer neural networks,hardware-based neural network,deep neural networks (DNNs),deep learning,NAND flash memory,neuromorphic
更新于2025-09-11 14:15:04
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Time-domain Formulation of a Multi-layer Plane Circuit Coupled with Lumped-parameter Circuits using Maxwell Equations
摘要： We calculate electromagnetic phenomena in the multi-layer plane circuit starting from the Maxwell equations. We present a numerical method of potential and current density in two-dimensional conductors, where their time developments are treated as phenomena of wave propagation. We treat the plane conductors by dividing them into small finite-volume elements, similar to the case of the partial element equivalent circuit method, and the transport equations are then solved by the finite-difference time-domain method. Furthermore, we develop a calculation method for the boundary in a multi-layer plane by applying the method we have used in multi-transmission lines. We formulate the boundary conditions of a multi-layer plane coupled with lumped-parameter circuits and introduce an algorithm to reduce calculation costs that are largely associated with the two-dimensional extension from the multi-transmission-line case. We perform calculations of the wave propagation of potential, current density, and charge density in the time domain for a simple plane circuit. these calculations are presented as supplementary materials of the present paper.
关键词： wave propagation,multi-layer plane circuit,electromagnetic phenomena,lumped-parameter circuits,potential and current density,numerical method,finite-difference time-domain method,Maxwell equations
更新于2025-09-11 14:15:04
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[IEEE IGARSS 2018 - 2018 IEEE International Geoscience and Remote Sensing Symposium - Valencia, Spain (2018.7.22-2018.7.27)] IGARSS 2018 - 2018 IEEE International Geoscience and Remote Sensing Symposium - Target Aspect Identification in SAR Image: A Machine Learning Approach
摘要： Identifying the aspect for a given target is an important issue in synthetic aperture radar (SAR) image interpretation. A new SAR target aspect identification method based on machine learning theory is proposed in this paper. First, the aspect angles of the SAR target are discretized, and the spatial relationships of the neighborhoods of the SAR target samples are established. Then an optimal linear mapping is solved based on the proposed subspace aspect discriminant analysis. The samples will be projected into a low-dimensional space and be of a better aspect identifiability than in their original space. Finally, the projected samples are fed into a multi-layer neural network, and the aspects of the SAR targets will be indicated. Experimental results have shown the superiority of the proposed method based on the moving and stationary target acquisition and recognition (MSTAR) dataset.
关键词： machine learning,Synthetic aperture radar,multi-layer neural network,target aspect identification
更新于2025-09-10 09:29:36
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[IEEE 2018 15th European Radar Conference (EuRAD) - Madrid, Spain (2018.9.26-2018.9.28)] 2018 15th European Radar Conference (EuRAD) - Differential Multi-Layer Compact Grid Antenna Array for 79 GHz Automotive Radar Applications
摘要： A novel wide band compact grid antenna array is developed for 79 GHz MIMO radar applications. The key issue is the stable radiation pattern with flat gain characteristic along the whole frequency bandwidth, which is very advantageous for the targeted radar applications. The antenna is taped out with the new high resolution multi-layer PCB technology, called “Any-Layer PCB”. This technology provides the possibility to stack micro-vias in PCB boards and reduce the fabrication cost compared to other multi-layer technologies in mm-wave bands. With this feature, the width of the array has been compacted with 17.2%, which leads to a higher side lobe suppression and an enhancement of the field of view in radar applications. A combined impedance and 3-dB gain band width of 9.6% is achieved. The gain and SLL are 13.52 dB and -14 dB at 79 GHz, respectively.
关键词： radar applications,multi-layer PCB technology,79 GHz radar,grid antenna array,millimeter wave
更新于2025-09-10 09:29:36