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Novel Siloxane-Modified Epoxy Resins as Promising Encapsulant for LEDs
摘要： This study investigated a new category of transparent encapsulant materials for light-emitting diodes (LEDs). It comprised a phenyl group that contained siloxane-modified epoxy (SEP-Ph) hybridized with a cyclic tetrafunctional siloxane-modified epoxy (SEP-D4) with methylhexahydrophthalic anhydride (MHHPA) as a curing agent. The SEP-Ph/SEP-D4 = 0.5/0.5 (sample 3) and SEP-D4 (sample 4) could provide notably high optical transmittance (over 90% in the visible region), high-temperature discoloration resistance, low stress, and more crucially, noteworthy sulfurization resistance. The lumen flux retention of the SEP encapsulated surface mounted device LEDs remained between approximately 97% and 99% after a sulfurization test for 240 h. The obtained comprehensive optical, mechanical, and sulfurization resistance proved the validity and uniqueness of the present design concept with complementary physical and chemical characteristics.
关键词： crosslinking density,surface mounted device LEDs,encapsulant,sulfurization resistance,siloxane-modified epoxy
更新于2025-09-16 10:30:52
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Integrated microsensor for precise, real-time measurement of junction temperature of surface-mounted light-emitting diode
摘要： Light-emitting diodes (LEDs) are widely used in many industrial applications owing to their high performance and efficiency compared with conventional lighting systems. However, a considerable amount of input power is inevitably dissipated into heat at the LED junction, which can degrade the performance and reliability of the LED; thus, it is important to monitor the change in the junction temperature of the LED. In this study, we present a micro-temperature sensor-integrated surface-mounted device (SMD) for accurate and real-time measurement of the junction temperature of an LED. The LED is mounted on a microfabricated Pt sensor in a similar way to the typical SMD assembly. The heat generated at the LED junction is conductively transferred to the microsensor, increasing the temperature and changing its electrical resistance. In contrast to the conventional techniques for thermal characterization of LEDs, the integrated microsensor provides real-time information on the junction temperature with high precision, reproducibility, and simplicity. Additionally, the temperature of the solder, which is not easily accessible but is closely related to the reliability of the LED, can be estimated by analyzing the thermal resistance of the LED package. Experimental and numerical results indicate a linear correlation (R2 = 0.988) between the junction and sensor temperatures, which is practically useful for the thermal management of the miniaturized SMD-LED.
关键词： Junction temperature,Light-emitting diode,Thermal transient test,Microsensor,Surface-mounted device,Thermal management
更新于2025-09-12 10:27:22