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Design and investigation of cooling system for high-power LED luminaire
摘要： This paper is concerned with development of cooling system for high-power LED luminaire, including design, simulation, production and investigation. Dimension, shape, and topology optimization algorithms and their program realization are developed with the use of MathCad. Thermal design by Comsol Multiphysics showed that the system on the base of heat pipes is the most effective system for cooling of high-power LED luminaire. The numerical simulation was employed to valid the designed-in engineering solution of cooling system for high-power LED luminaire under elevated temperature operating conditions and different orientation in space. In accordance to simulation data cooling system on the base of heat pipes is designed. Theoretical results are well validated by experimental data and numerical simulation and can be widely utilized for designing of cooling system related to various LED products.
关键词： Cooling system,Heat pipe,Thermal design,High-power LED luminaire
更新于2025-09-23 15:21:01
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Thermal design for the package of high-power single-emitter laser diodes
摘要： An analytical three-dimensional thermal model is employed to perform the thermal design for the package of high-power single-emitter laser diodes. Thermal design curves for the heat sink and submount are presented in detail, for laser diodes subjected to several convective heat transfer conditions on the bottom of the heat sink. An effective heat spreading angle is proposed to characterize thermal design for the heat sink. A differential heat spreading angle is proposed to clearly manifest heat flow in the packages. Full width and length at 90% energy are introduced to reveal the requirement of submount width and length, respectively. The impact of coefficient of thermal expansion (CTE)-matched sandwiched submount on total heat dissipation is studied. Special discussion is presented for a commercial F-Mount laser diode, and it is found that current heat sink design leads to a 27.4% increase in thermal resistance relative to a free lateral diffusion package.
关键词： Thermal resistance,Heat spreading angle,Submount,Heat sink,Thermal design,High-power laser diodes
更新于2025-09-23 15:19:57
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[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Evaluation of the Thermal Properties for the Design of the Semiconductor Device
摘要： The more semiconductor devices progress, the more importance of caring about heat dissipation from heat generation increase. This is called “Thermal design”. Thermophysical property values like thermal conductivity and thermal expansion coefficient are used as information for thermal design. The specified values in a brochure or literature data of similar materials are usually used as the thermophysical property values for the thermal design. However, when those values are used for simulation, the results may be wrong because an actual measured value such as rate of conduction of heat of an ingredient is different from literature data or the nominal value in many cases. It is thought that there are a lot of cases without considering directionality of an ingredient (anisotropy) and influence of joint interface. We propose that we should measure these values with considering anisotropy, size effect and the bonding state and utilize them for thermal design of electronic materials used in a semiconductor device.
关键词： Thermal diffusivity,Thermal conductivity,Thin film,Thermal resistance,Bonding layer,Anisotropy,Thermal design,Transient thermal measurement
更新于2025-09-10 09:29:36
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The mechanical and thermal setup of the GLORIA spectrometer
摘要： The novel airborne Gimballed Limb Observer for Radiance Imaging of the Atmosphere (GLORIA) measures infrared emission of atmospheric trace constituents. GLORIA comprises a cooled imaging Fourier transform spectrometer, which is operated in unpressurized aircraft compartments at ambient temperature. The whole spectrometer is pointed by the gimbal towards the atmospheric target. In order to reach the required sensitivity for atmospheric emission measurements, the spectrometer optics needs to operate at a temperature below 220 K. A lightweight and compact design is mandatory due to limited space and high agility requirements. The cooled optical system needs to withstand high pressure and temperature gradients, humidity, and vibrations. A new cooling system based on carbon dioxide and liquid nitrogen combined with high-performance insulation has been developed to meet the mechanical, thermal, and logistical demands. The challenging mechanical and spatial requirements lead to the development of a novel rigid linear slide design in order to achieve the large optical path difference for high spectral resolution. This paper describes the mechanical and thermal setup of GLORIA and presents the performance results on two different research aircrafts.
关键词： cooling system,atmospheric trace constituents,Fourier transform spectrometer,thermal design,mechanical design,GLORIA,infrared emission,airborne
更新于2025-09-10 09:29:36
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Thermal design and analysis of the high resolution MWIR/LWIR aerial camera
摘要： The thermal control technology of high resolution MWIR/LWIR aerial camera is studied. Thermal design and thermal analysis of the camera are completed according to thermal control indexes of infrared aerial camera. Firstly the architecture of the aerial camera and the external working environment are introduced, the camera heat exchange model is established, and the boundary conditions of radiation, conduction, convection and aerodynamic heat are analyzed, and then the thermal design of the camera is described in detail. Finally the thermal analysis of aerial camera is done, and a heat balance test has been done for the camera. The results show that: In the speci?ed environment, after two hours work the temperature range of optical system is 18.5 ℃ to 22.2 ℃, the temperature range of lens set is 19.1 ℃ to 20.3 ℃, the temperature range of detector module is 19.7 ℃ to 31.9 ℃, meet the thermal control indexes, at the same time, under extreme operating conditions, the thermal control system can meet the start-up requirements, the thermal design is feasible and reasonable. This research method and technical route have the guidance and reference signi?cance for the thermal control design of other infrared aerial cameras.
关键词： Infrared aerial camera,Thermal control system,Thermal design,Thermal analysis
更新于2025-09-04 15:30:14
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[IEEE 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Atlanta, GA, USA (2018.10.31-2018.11.2)] 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) - Thermal Characterization and Design for a High Density GaN-Based Power Stage
摘要： This paper proposes a methodology for extracting the thermal equivalent circuit of a high density GaN-based power stage, using a 48 V to 12 V GaN-based synchronous buck converter as the test platform. The test setup calculates the junction temperatures by measuring Rds,on for both FETs in the half bridge, while current sources produce power losses in each device and the output filter inductor. Independent control of the two gate voltages allows for either symmetric or asymmetric distribution of power loss between the two FETs, and comparison of these results are used to calculate the coupled and uncoupled thermal resistances between them. The thermal interaction with the filter inductor is similarly modeled. The baseline thermal design with a bare PCB and no heatsink was characterized, as well as a proposed thermal solution consisting of a heatsink, gap pad, gap filler, and a plastic shim. Each configuration was tested with three air flow conditions, and the resulting thermal model was used to estimate the maximum current capability without exceeding 100 °C on either FET. The proposed thermal solution improves the maximum current-handling capability by over 60% compared with the baseline design.
关键词： thermal characterization,eGaN FET,thermal design,HEMT,HFET,heatsink,junction temperature,GaN
更新于2025-09-04 15:30:14