Integrated microsensor for precise, real-time measurement of junction temperature of surface-mounted light-emitting diode

摘要： Light-emitting diodes (LEDs) are widely used in many industrial applications owing to their high performance and efficiency compared with conventional lighting systems. However, a considerable amount of input power is inevitably dissipated into heat at the LED junction, which can degrade the performance and reliability of the LED; thus, it is important to monitor the change in the junction temperature of the LED. In this study, we present a micro-temperature sensor-integrated surface-mounted device (SMD) for accurate and real-time measurement of the junction temperature of an LED. The LED is mounted on a microfabricated Pt sensor in a similar way to the typical SMD assembly. The heat generated at the LED junction is conductively transferred to the microsensor, increasing the temperature and changing its electrical resistance. In contrast to the conventional techniques for thermal characterization of LEDs, the integrated microsensor provides real-time information on the junction temperature with high precision, reproducibility, and simplicity. Additionally, the temperature of the solder, which is not easily accessible but is closely related to the reliability of the LED, can be estimated by analyzing the thermal resistance of the LED package. Experimental and numerical results indicate a linear correlation (R2 = 0.988) between the junction and sensor temperatures, which is practically useful for the thermal management of the miniaturized SMD-LED.