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[IEEE 2019 49th European Microwave Conference (EuMC) - Paris, France (2019.10.1-2019.10.3)] 2019 49th European Microwave Conference (EuMC) - Design of Aperture Coupled Feeding Ku-Band Phased Array Antenna on Multi-Layer PCB for Satellite Communications
摘要： In a phased array antenna system, beamforming integrated circuit (IC) is located directly behind the antenna and uses a multi-layer printed circuit board (PCB). As the frequency band becomes higher, the direct via feed method is not suitable for multi-layer PCB structure due to the decrease of transmission characteristics and the increase of manufacturing difficulty by use of blind via. This paper introduces the antenna using an aperture coupled feeding technique on multi-layer PCB for a Ku-band phased array antenna system. To verify the design, an antenna prototype is developed and measured at Ku-band for satellite applications. The antenna operates with left-handed circular polarization (LHCP) at center frequency of 11.9GHz and a peak gain of 15.2dBic.
关键词： automotive applications,Ku-band,slot antennas,satellite communication,phased arrays
更新于2025-09-12 10:27:22
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Thermal management and characterization of high-power wide-bandgap semiconductor electronic and photonic devices in automotive applications
摘要： GaN-based high-power wide-bandgap semiconductor electronics and photonics have been considered as promising candidates to replace conventional devices for automotive applications due to high energy conversion efficiency, ruggedness, and superior transient performance. However, performance and reliability are detrimentally impacted by significant heat generation in the device active area. Therefore, thermal management plays a critical role in the development of GaN-based high-power electronic and photonic devices. This paper presents a comprehensive review of the thermal management strategies for GaN-based lateral power/RF transistors and light-emitting diodes (LEDs) reported by researchers in both industry and academia. The review is divided into three parts: (1) a survey of thermal metrology techniques, including infrared thermography, Raman thermometry, and thermoreflectance thermal imaging, that have been applied to study GaN electronics and photonics, (2) practical thermal management solutions for GaN power electronics, and (3) packaging techniques and cooling systems for GaN LEDs used in automotive lighting applications.
关键词： semiconductor,Raman thermometry,infrared thermography,high-power,automotive applications,LEDs,thermoreflectance thermal imaging,GaN,thermal management,wide-bandgap
更新于2025-09-04 15:30:14